XYZTEC also offers a 300mm (12 inch) wafer testing machine for precision shear testing and Cold Bump Pull (CBP) with or without loader/unloader.
We ensure correlation for cross referencing test results between old and new platforms.
The Revolving Measurement Unit (RMU) enables continuous operation with up to six different test types on the one machine at forces up to 200kgf. Additionally, you can also choose for dedicated systems. XYZTEC is also unique in its high force products and next generation tweezers.
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Every seminar is focussed around a particular aspect of the science of bond testing.
|03 Jul||Exciting sales and service meeting in Bangkok|
|01 Jul||Bond Test Measurement Accuracy|
|17 Jun||Condor Sigma software now available in Vietnamese|
NEPCON South China
Semicon Taiwan 2015
20th European Microelectronics and Packaging Conference (EMPC)