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Maximize your tests per minute with the XYZTEC Condor Sigma

Condor Sigma bond tester

Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options, lowest cost of ownership, on board 10gf to 200kgf pull and shear sensors available at the touch of a button

XYZTEC also offers a 300mm (12 inch) wafer testing machine for precision shear testing and Cold Bump Pull (CBP) with or without wafer handler.

Superior speed

Superior speed

Featuring 50 mm/s the axes are very fast. Combined with efficient software, you get the highest UPH.



The Sigma's 1µm stage accuracy, large test volume and vision technology enable full automation.

Condor Sigma is easy to use

Easy to use

The most ergonomic system on the market. New operators learn to use the software within hours.



XYZTEC's consultants are happy to help you with any special bond testing requests you might have.

Condor Sigma test results correlate with older systems


We ensure correlation for cross referencing test results between old and new platforms.

Bond testing made easy

XYZTEC is the technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester on the market, providing leading customers with fully automated solutions.

The Revolving Measurement Unit (RMU) enables continuous operation with up to six different test types on the one machine at forces up to 200kgf. Additionally, you can also choose for dedicated systems. XYZTEC is also unique in its high force products and next generation tweezers.

Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Every seminar is focussed around a particular aspect of the science of bond testing.

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Technology leader in bond testing worldwide