HIGH SPEED IMPACT BONDTESTING

Condor 150-3 with Impact Measurement Unit

Impact Measurement Unit

The high speed impact test is becoming a very important test to determine the actual strength of the bond. Due to the use of Pb free solder the risk on interfacial brittle fracture failures has become higher. By using a high speed test it is possible to determine the brittleness of the bond interface. The Impact Measurement Unit is compatible with all installed XYZTEC bondtesters to perform high speed testing. The measurement principle is based on a pendulum. This and the maximum test velocity of 10 m/s makes the measurement unit compliant with all important high speed industrial test standards. Make sure to download our flyer about high speed impact bondtesting.

Features for the Impact Measurement Unit (IMU):

  1. Original production parts like in-line substrates, lead frames or wafers can be tested without modification or preparation. It is not necessary to clear non-test items. This results in a short preparation time for test samples.
  2. Non destructive impact test is supported.
  3. Controlled added torque allows maximum velocity of 10 m/s.
  4. Automatic load and release of the pendulum.
  5. Test cycle time of ~10 seconds to support high units per hour.
  6. Multiple balls can be tested during one test sequence.
  7. Total BGA impact test can be performed by using a Grid Array Tool.
  8. Specially designed for a production environment. Maximum safety for the operator. No dangerous high velocity moving parts like work holder, driving belt or motor. No debris of solder balls can fall between moving parts.
  9. Solder balls can be collected after the test for further analysis.
  10. Rigid test setup, with minimal deflection.
  11. Impact testing during automation is supported.
  12. Measurement results are: impact velocity, impact energy and absorbed energy.
  13. No influence of frictions, vibration and fluctuating motor velocity.
  14. The pendulum is a proven design based on Izod and Charpy test methods.
  15. Supports the following industrial standards:
    JEDEC: JESD22-B104, -B110, -B111 and -B117,
    ISO: 179, 180, 6603, 7765, and 8256,
    ASTM: D256, D1822, D3763 and D4812.
    Please contact us to check compliance to other standards.