

To make the most advanced bond tester on the market, we combined the unique strengths of the Condor series with the latest technologies and innovations. With the introduction of the Condor Sigma platform we break the legacy by introducing a unique modular sensor system that delivers state of the art accuracy, with ultimate flexibility featuring unparalleled 0.075% accuracy. These sophisticated force sensor modules will become the new benchmark in the specialized world of bond testing.

All sensor modules use the same interface and are secured with one simple screw into either a single measurement unit or RMU. The procedure of fitting, removing or swapping a single sensor module takes only a few minutes. Each sensor module features their own digital electronics which is configured for the force transducer. The modules are ready to use having been fully tested and calibrated.
A wide variety of tests is possible using the Condor Sigma with forces ranging from less than 1 gf to 200 kgf. Digital temperature correction and the world’s highest resolution of 24 bits contribute to the most reliable and repeatable measurement results.
| Pull | 10 gf, 100 gf, 1 kgf, 10 kgf and 100 kgf |
| Push | 10 gf, 100 gf, 1 kgf, 10 kgf and 100 kgf |
| Shear | 10 gf, 100 gf, 1 kgf, 10 kgf, 100 kgf and 200 kgf |
| Tweezers, CBP | A range of tweezers options is available up to 50 kgf |
Did we catch your attention? Please contact us for more information or to request a demonstration or a quotation.
Click here to download the "Condor Sigma flyer" (PDF).
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| 06..07 | Mar | IMAPS Device and Packaging 2012 |
| 08..09 | Mar | Fraunhofer Institut IWM - Opening CAM |
| 20..22 | Mar | Semicon China 2012 |
| 11..13 | Apr | Photonix 2012 |
| 16..19 | Apr | CICMT 2012 (IMAPS) |
| 02..04 | May | Semicon Singapore 2012 |
| 08..10 | May | PCIM Europe 2012 |
| 08..10 | May | SMT Hybrid Packaging 2012 |
| 15..17 | May | SENC PV Power |
| 15..16 | May | Semicon Russia 2012 |