1 July 2010
Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. Examples include solder ball pull (often referred to as CBP) and ribbon peel. The sizes of parts range from a few millimetres to tens of microns and the bond strength from several kilograms to one or two grams force. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient force can be applied to the bond but without the act of griping affecting the bond itself. To cater for this XYZTEC developed a new generation of tweezer with both a precise gripping action and the flexibility to suit a wide range of applications.
The gripping jaws (Tweezers or tips) are driven by a built‐in 3‐phase brushless micro drive to accurately open or close and the jaw actuators incorporate a strain gauge to precisely measure and control the grip force. There is a choice of two types of motor, standard force or high force, refer to the specification for the performance details. The combination of positional and force control provides programmable control of all the gripping functions,
| Specification | Standard force | High force |
| Max. closing force | 1.5 kgf | 2.5 kgf |
| Max. jaw opening | 0.8 mm | 0.8 mm |
| Pull force* | 1.0 to 1.5 kgf | 5 to 6 kgf |
| Min. closing time | 3.5 s | 17.5 s |
See also our webpage on the USB Tweezers.
Click here to download the complete "USB Tweezers Technical Informer" (PDF) by XYZTEC.
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