XYZTEC is the technology leader in bond testing worldwideCopyright XYZTEChttp://www.xyztec.cominfo@xyztec.comen60Thu, 03 May 2012 14:01:28 +0200http://www.xyztec.com/news/29/High%20interest%20in%20self-alignment%20tool%20on%20Fraunhofer%20Technology%20Dayhttp://www.xyztec.com/news/29/High%20interest%20in%20self-alignment%20tool%20on%20Fraunhofer%20Technology%20DayMon, 12 Mar 2012 23:59:59 +0100 More than 200 people visited the Fraunhofer IWM Industry Workshop and Technology Day in Halle/ Saale (Germany) last week. This event was sponsored by multiple companies including XYZTEC. The workshop was titled "Failure Analysis and Material Characterization in Micro-Electronics, Microsystem Technologies and Nano-Technology Industry". Since 2003 the Fraunhofer IWM and XYZTEC have successfully worked together on multiple projects and built a strong relationship. This made Dirk Schade, global sales director for XYZTEC, a logical choice as one of the speakers during the event. He showed multiple test opportunities that can be performed on a XYZTEC Condor bond tester in a work shop titled "Mechanical Testing for Quality Surveillance of Power Electronics Components". Especially the patented self-alignment tool and impact measurement unit drew a lot of attention.http://www.xyztec.com/news/28/Introduction%20of%20Sigma%20at%20Semicon%20Koreahttp://www.xyztec.com/news/28/Introduction%20of%20Sigma%20at%20Semicon%20KoreaWed, 08 Feb 2012 23:59:59 +0100 Together with KAMI, XYZTEC is exhibiting this week at Semicon Korea. This is the first time the Condor Sigma is in Korea. We invite all our Korean customers and all people that are interested in bond testing to visit our stand in Hall C, booth 1652 to come and see the Condor Sigma in action. Also on the show is our Condor 150HF with a rotating table that can shear up to 500 kgf. Both machines are attracting a lot of attention. The Semicon Korea is held from 7 to 9 February 2012 in Seoul.http://www.xyztec.com/news/27/Condor%20Sigma%20in%20Japanhttp://www.xyztec.com/news/27/Condor%20Sigma%20in%20JapanWed, 18 Jan 2012 23:59:59 +0100 Following the introduction on Productronica in November, the Condor Sigma is doing a tour around the world. This week, XYZTEC is exhibiting at INTERNEPCON JAPAN together with our representative Techno Alpha. We invite all our Japanese customers and all people that are interested in bond testing to visit our stand in East Hall E13-18 to come and see the Condor Sigma in action. The 41st INTERNEPCON JAPAN is being held from 18 to 20 January at Tokyo Big Sight , Japan. The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Whether you need a dedicated or multipurpose bond tester, the Condor Sigma is the best choice featuring unparalleled 0.075% accuracy, the best ergonomics, highest throughput, maximum flexibility and the lowest cost of ownership. Read more...http://www.xyztec.com/news/26/Interelec%20Electronics%20AG%20switches%20to%20XYZTEChttp://www.xyztec.com/news/26/Interelec%20Electronics%20AG%20switches%20to%20XYZTECThu, 22 Dec 2011 23:59:59 +0100 This week XYZTEC signed yet another new partner to improve its international sales and distribution network: Interelec Electronics AG. Interelec Electronics AG is active in the territories Switzerland and Liechtenstein and has over 20 years experience selling bond testing equipment. XYZTEC has been willing to get Interelec on board as distributor for a longer time and it was ultimately the Condor Sigma that convinced the Swiss company to make the switch. “When I saw the performance of the Condor Sigma during Productronica in Munich, I realized this is the future of bond testing. XYZTEC is definitely technology leader”, says Albert Lehner, CEO of Interelec. Among Interelec’s other principles are various suppliers of manual and automatic wire and die bonders, as well as suppliers of manufacturing- and testing-equipment. Representative for Switzerland Interelec Electronics AGAlemannenweg 6CH - 8803 RüschlikonSwitzerlandwww.interelec.chTel: +41-44-7045050Fax +41-44-7045069inel@interelec.ch Other representatives Select your region To find your local representative, please select a region: Americas Europe, Middle East, Africa Greater China Japan Asia / Pacific http://www.xyztec.com/news/25/Successful%20seminar%20at%20Tianjin%20University%20on%20Packaging%20High-temperature%20Electronicshttp://www.xyztec.com/news/25/Successful%20seminar%20at%20Tianjin%20University%20on%20Packaging%20High-temperature%20ElectronicsThu, 08 Dec 2011 23:59:59 +0100 XYZTEC looks back on a very successful seminar together with Tianjin University on “Challenges and Opportunities in Packaging High-temperature Electronics”. This conference was visited by more than 80 people from leading companies in China, sharing knowledge. On behalf of co-host XYZTEC, Dirk Schade presented information about the latest possibilities in high force IGBT application testing. Different users from different countries met and were excited to discuss new manufacturing and testing techniques. Among the other speakers on the event were Professor Guo-quan Lu from Tianjin University and representatives from Orthodyne Electronics. The Sinter technology and Cu wire bonding attracted a lot of attention. The visitors of the seminar used the breaks between the various sessions for sharing experience.http://www.xyztec.com/news/24/Condor%20Sigma%3A%20Performance%20and%20Flexibilityhttp://www.xyztec.com/news/24/Condor%20Sigma%3A%20Performance%20and%20FlexibilityTue, 15 Nov 2011 23:59:59 +0100 Today before a sizeable audience at Productronica in Munich Germany, XYZTEC launched the Condor Sigma. Performance and flexibility The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Whether you need a dedicated or multipurpose bond tester, the Condor Sigma is the best choice featuring unparalleled 0.075% accuracy, the best ergonomics, highest throughput, maximum flexibility and the lowest cost of ownership. Use existing tools and work holders This system is designed to be compatible with the most commonly used work holders and tooling, that you may already have in stock. The compatibility modes ensure consistency in your measurement results across machines. Equipped with the most powerful intuitive software, operators can quickly learn to use the Condor Sigma alongside your existing equipment and procedures. Revolving Measurement Unit up to 200 kgf XYZTEC is well known for many innovative bond testing solutions. The Revolving Measurement Unit (RMU) is one of the results of XYZTEC engineering team utilizing customer feedback. Now the capability of the RMU achieves up to 200 kgf shear and 100 kgf pull and push. The flexible configuration allows 1 to 6 sensors enabling fully automatic and manual testing. Compared to changing cartridges manually, the RMU eliminates warm up time and greatly reduces the risk of sensor damage. Built in image capture and automation camera The standard configuration contains a perpendicular automation camera at a small offset from the test point with a choice of two magnifications and optical resolutions down to 1.5 μm. The Condor Sigma can be equipped with a maximum of three separate cameras mounted in different positions to offer the best range of imaging possibilities. For automation, fiducial mark recognition is available. Soft landing and high resolution A wide variety of tests is possible using the Condor Sigma with forces ranging from less than 1 gf to 200 kgf. Digital temperature correction and the world’s highest resolution of 24 bits contribute to the most reliable and repeatable measurement results. The shear landing force is programmable to a minimum of a few grams. Even on a higher speed a soft landing is possible. Featuring 50 mm/s the X, Y & Z axes are very quick and power up in any position. Modular and open design All sensor modules are interchangeable and fit any single heads and the Revolving Measurement Unit. Fully calibrated and tested, each sensor module can be removed and replaced within a few minutes. The open frame design and large stroke for all three stages offer the capability to handle the widest range of sample sizes with little or no special tooling. High accuracy quick release work holders and measurement units ensure rapid sample loading and production setup. Put it to the test! With 10+ years in house experience, XYZTEC takes bond testing to a new level with the Condor Sigma. It uses the best of established technology together with innovation to set the new standard. Its broad specifications ensure it has the capability to perform all commonly used industry tests as well as special and challenging applications. Current users of bond test equipment will find that the Condor Sigma system will provide an easy transition from their existing process to the state of the art Condor Sigma platform. Performance is without a doubt best in class, but do not take our word for it. Try it for yourself, and put it to the test! Click here to find out more about the Condor Sigma.http://www.xyztec.com/news/23/New%20test%20method%20for%20mechanical%20strength%20evaluation%20of%20solar%20cell%20solder%20jointshttp://www.xyztec.com/news/23/New%20test%20method%20for%20mechanical%20strength%20evaluation%20of%20solar%20cell%20solder%20jointsTue, 06 Sep 2011 23:59:59 +0200By: R. Klengel*, R. Härtel*, S. Schindler**, D. Schade***, B. Sykes*** Motivation A standardized method with clearly defined good-bad-criteria is not available for testing solder joints that connect single cells into strings. Thus, a comparative characterization of different manufacturers, cell types, base- and joining materials or joining technologies is impossible. The most commonly used test for solar cell ribbon interconnects is the pull test, as used in micro-electronics. For thin, brittle, large area silicon solar cells substantial modifications of the test equipment and methodology are required to realize a suitable metrology. In addition the factors influencing the defect conditions in multi crystalline material, high strains around the solder connect and inhomogeneous contact interfaces has to be considered. New test methodRequirements to the test method: reproducible (stabile test conditions, no silicon tears, …) comparable (manufacturer, cell types, base- and joining materials, joining technology, …) easy to handle (less handle steps, semi-automatic, little operator influences) high throughput (little setting-up time, high test speed) simply analyzable (statistics, visualization of test values and failure interface) possible correlation to micro structure of solder joints A XYZTEC Condor 250 multifunctional test machine was upgraded with a new designed test setup. The machine includes a vertical moving z-axis equipped with a force sensor and a x-y-stage for horizontal movement of the work holder. The X-Y table moves the cell at the same velocity than the z-axis pulls the solder ribbon. Thus the point of breakage remains under the measuring head and the test range equates to the ribbon length. Results The graphical analysis of the measurement results and the images of the fracture interface allow correlating the pull force values with the corresponding failure mode. Every single change in the fracture interface is reproducible in the progression of the curve. So it seems to be possible to conclude to the solder joint condition by interpreting the measured curve. To correlate the pull test measurement curves and fracture interfaces with concrete interface weakening like voids, non-wetted areas or microcracks etcetera different non-destructive analyzes of soldered bus bar interconnects like scanning acoustic microscopy (SAM) or X-ray inspection with following validation by metallographic cross sections were performed before the pull test. Summary With the developed test equipment and measurement routine it is succeeded to provide a reproducible, fast and easy handable method which is usable independent from solar cell geometry, condition of contact materials, soldering technology or manufacturer. It is possible to correlate the measurement curve of the pull test with the fracture interface. This allows to interpret the results with statements in terms of the solder joint quality. *Fraunhofer Institute for Mechanics of Materials IWM, Walter-Huelse-Strasse 1, 06120 Halle (Saale), Germany Phone +49 (0) 345/5589-159, robert.klengel@iwmh.fraunhofer.de ** Fraunhofer Center for Silicon Photovoltaics CSP, Walter-Huelse-Strasse 1, 06120 Halle (Saale), Germany ***XYZTEC b.v., J.F.Kennedylaan 14-B, 5981 XC Panningen, The Netherlands Download as PDF Click here to download the complete "Mechanical Strength Evaluation of Solar Cell Solder Joints by Developing a New Test Method" as PDF. Acknowledgement This work was partly supported by the German Ministry of Economics and Technology under contract “ATSOLOT” (FKZ01FS10010).http://www.xyztec.com/news/22/Case%20studies%3A%20Danfoss%2C%20flexibility%20and%20deep%20accesshttp://www.xyztec.com/news/22/Case%20studies%3A%20Danfoss%2C%20flexibility%20and%20deep%20accessTue, 28 Jun 2011 23:59:59 +0200 Today we lauch a new section to our website: case studies. As technology leader in bondtesting, XYZTEC has produced lots of success stories since the company was incorporated in 2000. Some customers gave us permission to publish a case study. We launch the section with two case studies: Danfoss and the fully automated LED wafer testing case. In the near future, we will be adding more case studies. Danfoss Danfoss A/S is an international Group and a leader in research, development and production of mechanical and electronic components and solutions. The company employs approximately 24,000 people globally. Production takes place in 79 factories in 22 countries. Danfoss Silicon Power was founded in August 1998 as a subsidiary of Danfoss and is located in Schleswig, Northern Germany. With the activities of Danfoss Silicon Power, the Danfoss Group has extended its competence in the field of power electronics. Danfoss Silicon Power develops and produces electronic power modules for many applications, such as frequency converters, power supplies, renewables and automotive. The business unit has its core competences within lead-free soldering of large surfaces and unique capabilities within thermal design. Danfoss products are sold and serviced all over the world by a global network. Flexibility and deep access During 2004, the Danfoss management made the decision to replace their older generation of quality control equipment, including the bond testers. They found XYZTEC as bond tester supplier and evaluated the Condor 150-3 and 250-3 for their production lines. Especially with respect to deep access, Danfoss had some special requirements. Both testers offered them high flexibility and also met their high quality standards. Click here to read the rest of this case study...http://www.xyztec.com/news/21/Fully%20automated%20LED%20wafer%20testinghttp://www.xyztec.com/news/21/Fully%20automated%20LED%20wafer%20testingTue, 14 Jun 2011 23:59:59 +0200 The challenge: high throughput, low operator influence, cost savings A leading LED (Light Emitting Diode) manufacturer approached XYZTEC with an interesting challenge. They wanted to integrate 100% gold ball shear testing in their production lines of 2 and 4 inch LED wafers, while reducing labor costs. It was also required to interface with their software infrastructure to merge the production lot data with measurement results. Of course, the highest possible accuracy, repeatability and traceability were of utmost importance. Their previous bondtester supplier could not provide a solution. The solution: fully automated Condor 100 In close collaboration with the customer, XYZTEC developed a unique automation integrated solution, based on the standard Condor 100 platform. A sophisticated customized workholder makes it easy for the operator to vacuum clamp the wafer on the tester, while providing high reproducible positioning accuracy, required for the full automation. Once the wafer is in place, the operator will scan the product identification barcode and the software automation macro is activated. Within 3 minutes, 30 selected bonds on the wafer are shear tested without intervention by the operator. The software carries out an extensive routine, selecting the correct sensors on the RMU and driving to the precise positions to do shear tests. To prevent gold wire residue from obstructing the tool, a special designed air nozzle with minimum air flow directs the gold wire residue into a collecting box. During automatic testing, the operator may watch the machine from a distance, as the camera image, which is shown on a second monitor, provides a clear visual image during testing. This eliminates the need for similar periodic inspection through a microscope enabling multiple machines to be easily and efficiently overseen from a distance. At the end of the procedure, or in case of a problem, the operator is alerted by a clear visual signal on the screen (for example orange to for operator input, red for failures). The Condor system is configured in such a way that a camera takes a picture of each test which is outside a predefined range and stores it on the central database server for further, off-line investigations. As the images are relationally linked to the database, full traceability is offered to its measurement data. All data import and export functions are automatically running in the background and cannot be influenced by the operator. Today, no less than eight Condor 100's are running day and night at this customer facility. The fact that all testing is carried out automatically minimizes operator influence and produces stable and constant measurement results. "Training time for new employees to learn to work with the XYZTEC bondtester is minimal", says the quality control manager. Why XYZTEC? The choice for XYZTEC was simple, when the previous bondtester supplier turned out not to be capable of fulfilling all requirements. XYZTEC's local sales and support team in Taiwan stepped in and created a working solution within two months, making the bridge between the customer and the headquarters R&D team of XYZTEC in The Netherlands. "The XYZTEC experts were very responsive throughout the project and exceeded all our expectations. A huge difference with our previous supplier!", says the quality control manager. Labor cost analysis The total savings on labor costs alone when choosing for the XYZTEC fully automated wafer testing solution can amount to 1,600,000 RMB or 240,000 USD per year, as the following table shows:  CompetitionXYZTEC  Manual operationAutomation Machines6 sets6 sets Operators6 people1 person Four shifts24 people4 people Overall labor cost (China)24 x 80k RMB = 1,920,000 RMB24 x 12k USD = 288,000 USD4 x 80k RMB = 320,000 RMB4 x 12k USD = 48,000 USD Video showing a LED wafer being tested automatically http://www.xyztec.com/news/20/Tim-Nordic%20and%20XYZTEC%20partner%20up%20to%20improve%20bond%20testing%20in%20Finland%20and%20Baltic%20stateshttp://www.xyztec.com/news/20/Tim-Nordic%20and%20XYZTEC%20partner%20up%20to%20improve%20bond%20testing%20in%20Finland%20and%20Baltic%20statesFri, 08 Apr 2011 23:59:59 +0200 XYZTEC, technology leader in bond testing worldwide, continually works to improve its international sales and distribution network. The most recent new partner is Tim-Nordic Oy, an experienced company that serves Finland and the Baltic states. Tim-Nordic is an independent Finnish company, specialised in electronics manufacturing and test applications. Tim-Nordic's employees have more than sixty years experience in the industry. The company uses the slogan: your expert in technology. Together, XYZTEC and Tim-Nordic seek to make bond testing more accurate, more reliable, easier and more cost effective in Finland, Iceland, Estonia, Latvia and Lithuania. XYZTEC is 100% focused on bond testing, has established itself as technology leader in bond testing worldwide and offers a broad range of bond testing products. Representative for Finland and Baltic states Tim-Nordic OyOlarinluoma 16FI-02200 EspooFinlandwww.timnordic.fiTel: +358-207-639190Fax: +358-9-35055333sales@timnordic.fi Other representatives Select your region To find your local representative, please select a region: Americas Europe, Middle East, Africa Greater China Japan Asia / Pacific http://www.xyztec.com/news/19/Employees%20donate%20to%20Japan%20relief%20efforthttp://www.xyztec.com/news/19/Employees%20donate%20to%20Japan%20relief%20effortFri, 08 Apr 2011 23:59:59 +0200 A few weeks ago, Japan was struck by the most powerful earthquake to hit the island nation in recorded history and the tsunami it unleashed. The news was a shock to our employees, especially to those with friends and family in Japan and those who work closely together with our partners and customers there. Spontaneously, one of our employees started a fundraiser for the relief effort and many donated a portion of their salary. "I felt very sad especially when I saw the pictures of the suffering children, most of which lost their parents. I'm the father of two kids, we love our family. We could feel what they feel at this difficult moment", said the fundraiser. Today, we transmitted the raised funds to the International Federation of Red Cross and Red Crescent Societies and by this news article, we would like to motivate all our website visitors to make a donation too.http://www.xyztec.com/news/18/HITECH%20Eletr%C3%B4nica%20represents%20XYZTEC%20in%20Brazilhttp://www.xyztec.com/news/18/HITECH%20Eletr%C3%B4nica%20represents%20XYZTEC%20in%20BrazilMon, 14 Mar 2011 23:59:59 +0100 HITECH Eletrônica Industrial e Comercial recently signed on as XYZTEC's exclusive sales and service representative for Brazil. Headquarters in Sao Paulo, and satellite offices in Manaus and Indaiatuba, HITECH brings extensive knowledge of the local market to grow sales in Brazil. Together, XYZTEC and HITECH seek to make bond testing more accurate, more reliable, easier and more cost effective in Brazil. XYZTEC is 100% focused on bond testing and has established itself as technology leader in bond testing worldwide and offers a broad range of bond testing products. HITECH São Paulo Av. Adolfo Pinheior, 1000 SL-204734-002 Alto e Boa VistaSao Paulo, SP BrasilTel: +55-11-2182-4300Fax: +55-11-2182-4360www.hitech.com.br HITECH Manaus Rua Prof. Emani Simão, 1658Cachoeirinha 69065-000Manus - AM - BrasilTel: +55-92-3233-9536Fax: +55-11-3094-3860www.hitech.com.br HITECH Indaiatuba Rua Vicente, Martini, 201Bairro Comercial Vitória13347-621Indaiatuba / SP BrasilTel: +55-19-3935-2706Fax: +55-19-3935-2706www.hitech.com.br Other representatives Select your region To find your local representative, please select a region: Americas Europe, Middle East, Africa Greater China Japan Asia / Pacific http://www.xyztec.com/news/17/XYZTEC%20participates%20in%20Solar%20Module%20Value%20Chain%20for%20International%20BIPV%20Conceptshttp://www.xyztec.com/news/17/XYZTEC%20participates%20in%20Solar%20Module%20Value%20Chain%20for%20International%20BIPV%20ConceptsFri, 04 Mar 2011 23:59:59 +0100Today was the official launch of the SMart Chain project, which aims for the development of new international Building Integrated PhotoVoltaics (BIPV) concepts. In this project, XYZTEC cooperates with various research institutes and Dutch corporations like TNO, ECN and Rimas. XYZTEC will provide Quality Control (QC) test and measurement methods and Statistical Process Control (SPC) software designs. The SMart Chain is partly made possible by the provinces of Limburg and Noord-Brabant and AgentschapNL as part of the Pieken in de Delta innovation program.http://www.xyztec.com/news/16/XYZTEC%20proudly%20presents%20its%20Korean%20websitehttp://www.xyztec.com/news/16/XYZTEC%20proudly%20presents%20its%20Korean%20websiteThu, 06 Jan 2011 23:59:59 +0100XYZTEC, the technology leader in bond testing worldwide, today proudly presents its Korean website. Most parts of the site, a knowledge base on the art of bond testing, have been translated in close cooperation with our top class Korean distributor KAMI. Click here to access XYZTEC's Korean websitehttp://www.xyztec.com/news/15/Aubert%20Dupont%20speaks%20at%20IEEE%20CPMT%202010http://www.xyztec.com/news/15/Aubert%20Dupont%20speaks%20at%20IEEE%20CPMT%202010Mon, 06 Dec 2010 23:59:59 +0100This wednesday, December 8th, the Finnish IEEE CPMT chapter is organizing an one day seminar in Helsinki on "Current Topics on Board Level Reliability of Electronics". Among other speakers Aubert Dupont, co-founder of XYZTEC, will speak. The emphasis will lay on the current and possible future methods for solder bond testing. Date: December the 8th, 2010 Time: 14:00 – 17:40 Place: Aalto University School of Science and Technology, Otakaari 7A, Seminar room 432. Program: 14:00Opening of the seminar 14:01“The Right Solder Paste for your Process” - Emmanuelle Guene – Inventec Performance Chemicals 14:25“Solder Paste Residue Corrosivity Assessments” - Emmanuelle Guene – Inventec Performance Chemicals 14:50“Optimization of the Surface Mount Process for Better Reliability” - Jussi Hokka – Aalto University 15:15“Formation of Microstructures in SnAgCu Solder Interconnections” - Vesa Vuorinen – Aalto University 15:40Coffee break 16:00“Effects of Alloying Elements on the IMC layers – Case of Cu and Ni” - Vesa Vuorinen – Aalto University 16:25“An Overview of Failure Mechanisms under Different Loading Conditions” - Toni Mattila – Aalto University 16:50“An introduction to Bond Testing” - Aubert Dupont - XYZTEC 17:15“Current and possible Future Methods for Solder Bond Testing” - Aubert Dupont - XYZTEC 17:40Closing of the seminar