
The LED (Light Emitting Diode) technology continues to grow requiring new and innovative bond testing solutions. Standard LEDs have evolved over the years to HB (high brightness) LEDs. The road map for 2012 is UHB (ultra-high brightness) LEDs.
During daily use, LEDs are exposed to extreme stress levels. Thermo mechanical aging of the dies and bonds are of great concern. Thus, XYZTEC offers wire pull, ball shear, die shear and special tests for wafers and optical components.
In close collaboration with the customer, XYZTEC developed a unique automation integrated solution, based on the standard Condor 100 platform.
Please contact us for more information, to request a demonstration or a quotation.
A wide variety of test types are relevant for LED, among which are:
Pull testing |
Shear testing |
Please contact us if you have any special tweezer requirements.