CBP Tweezer prior to closing

Cold bump pull

Pull test solder balls
Sensor accuracy ±0.1% of range
Produces failure modes of interest like IMC bond failure and Pad Crater
Reproduces pull loads that typically occur in most real failure events
Test ball geometries down to 100µm diameter (dependent on ball height to diameter ratio)
Grip force
Closing speed
Open and closed positions

Difference between Shear and CBP test

Advantage of cold bump pull

Cold Bump Pull (CBP) testing with the XYZTEC USB tweezers provides unparalleled precision and control. The bond of many solder balls is at the bottom of a cavity formed by solder resist layer. In a shear test this supports the bond, resulting in a predominance of solder shear failure modes. In a pull test the bond is not supported in this fashion, leading to the possibility of more relevant failure modes. Special jaws are required to grip the ball. These reform the upper part of the ball to enable the pull load to be applied without disturbing the bond.