High speed impact

Brittle failure analysis
Impact testing up to 4 meters/second
Constant energy input
Accurate force versus displacement data and analysis giving:
- Peak force
- Energy before and after peak load
- Total energy
- Test velocity
In accordance with JEDEC JESD22-B117A

Ideal for testing solder ball resilience to mechanical shock

Failure modes

High speed testing is used for manufacturing and end use failure mode analysis and quality assurance. Traditional low speed testing (less than 10mm/s) will almost always result in a shear through the solder (ductile failure), which is usually not the failure mode of interest. Testing at higher speeds can produce other modes and more useful data. Such data is more relevant to the bonds resistance to mechanical shock. It can supplement and even replace Board Level Drop Testing.

As the test speed is increased there is often a transition from ductile failure to brittle fracture in the IMC, as can be seen in the following example: