Thin wire gold pull test

Wire pull

Sensor accuracy ±0.1% of range
Rotational accuracy ±0.05°
Complies with industry standards
Destructive and non-destructive testing

Thick wire on high power module

Thick wire aluminium pull test

Wire Pull Testing applies an upward force under the wire, effectively pulling it away from the substrate. There are many types of pull tests, therefore XYZTEC offers a solution for each type. The pull test can be performed on wires or ribbons. The material of the wires or ribbons is mostly gold, aluminium or copper.

Majority of tests are performed with a 90° hook that is positioned under the wire. The Z-stage then moves up and the wire is pulled. The alignment of the hook under the wire is very important to obtain reproducible measurements. This can be ensured using our semi-automatic or fully automatic testing compliant with DVS2811.