In the fast-changing world of semiconductors, the demand for precision, efficiency, and reliability is key. Chiplets and Advanced Packaging have a revolutionary impact on chip design and manufacturing by breaking […]
Xyztec is currently showcasing the latest innovations at the Productronica exhibition in Munich. The event, which runs from November 14 to 17, is considered the largest international event for the […]
At Xyztec, we take pride in pushing the boundaries of bond testing technology and delivering tailored solutions to meet your unique testing needs. Our dedication to customization is unmatched. A […]
Our agent Extripod Electronics Technology Limited is at the China Semiconductor Packaging and Test Market & Technology Annual Conference (CSPT) from October 25th to 26th, showcasing the incredible Sigma W12 […]
At Xyztec, we always look for ways to enhance your manufacturing processes. Our Sigma bond testers are now fully GEM300 compliant, offering you an opportunity to achieve seamless communication and […]
Xyztec was at the SEMICON show in Taiwan from September 6th to 8th in Taipei, fascinating the audience with groundbreaking innovations.
Are you seeking the ultimate bond tester that combines unparalleled accuracy, effortless setup, and cutting-edge automation capabilities? Look no further than the Sigma bond tester! This newsletter will explain the […]
At Xyztec, we believe in pushing the boundaries of innovation to bring you the most advanced bond testing solutions. As the global leader in bond testing, we are proud of […]
We are thrilled to announce the release of software version 5.17 for our Sigma bond testers! This highly anticipated update brings exciting new features and improvements to enhance your testing […]
Xyztec is making a remarkable presence at SEMICON China 2023 from June 29 to July 1, 2023, at the Shanghai New International Expo Centre.