Impact Measurement Unit


Cost effective solution that can be fitted to a XYZTEC Condor Classic

Impact testing is an optional measurement unit (not a completely different machine) that can be installed on to a XYZTEC Condor Classic saving cost and space. The test is based on the long established Charpy pendulum method but with precision sensors that measure the test force on the shear tool and its position enabling accurate Force versus Displacement graphs of the test.

Because the tool moves not the test piece, large and heavy samples present no problem. Similarly heated sample chucks can be used to test the bond at elevated temperatures as may be the case in real life loading conditions. The pendulum design also allows test impact energy and rate of strain to be selected. These may be configured to cause the bond to fail on the first impact or after many impacts if the fatigue life is of more interest (see our page on impact testing).


Specification
Force measuring16 bits @ 5 MHz (max)
Position measuring23 bits @ 20 MHz (max)
Output metricsTest force, test energy, test displacement, force versus displacement graph, velocity versus displacement graph
Maximum test speed4 m/s
Maximum sample size [WxDxH]500x250x150 (mm)
Maximum sample weight10 kg
Heated sample maximum temperature500 C


Specifications subject to change without prior notice. Larger/heavier samples may be possible. Contact us for more information.


Contact us

Did we catch your attention? Please contact us for more information or to request a demonstration or a quotation.


Contributors

The development of the IMU was made possible by:

Europese Unie Provincie Limburg
Ministerie van Economische Zaken OP-Zuid

Relevant applications


Special applications

Please contact us if you have any special tweezer requirements.

Download article

Click here to download the article "Alternative Testing Methods for Electronic Assemblies" (PDF) by Mathias Nowottnick and Andrej Novikov from the University of Rostock and Dirk Schade and Bob Sykes from XYZTEC.

Download article

Click here to download the article "Effect of Temperature on Transition in Failure Modes for High Speed Impact Test of Solder Joint and Comparison with Board Level Drop Test" (PDF) by Pradosh Guruprasad and James Pitarresi, Binghamton University, USA and Bob Sykes, Chief Technical Officer for XYZTEC.

Download article

Click here to download the article "Effect of Temperature on Transition in Failure Modes for High Speed Impact Test of Solder Joint and Comparison with Board Level Drop Test" (PDF) by Pradosh Guruprasad and James Pitarresi, Binghamton University, USA and Bob Sykes, Chief Technical Officer for XYZTEC.

Presentation

Click here to download the article "Alternative Testing Methods for Electronic Assemblies" (PDF) by Mathias Nowottnick and Andrej Novikov from the University of Rostock and Dirk Schade and Bob Sykes from XYZTEC.

Relevant test types

A wide variety of test types are relevant for this industry, among which are:


Pull tests


Bending test


Special applications

Please contact us if you have any special tweezer requirements.


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