XYZTEC赛世铁克的专利权高强度芯片剪切测试工具的改进
XYZTEC赛世铁克的专利权高强度芯片剪切测试工具的改进

XYZTEC赛世铁克的专利权

Challenging traditional approaches, XYZTEC's dedicated R&D team have developed a number of innovative technologies that provide a variety of ways to improve bond testing. Some of these developments are protected by patents, granted in Europe, the United States of America, China, Taiwan and/or other territories. Among these are:

Digital creep and drift correction

2016315

Sensor apparatus for determining a deformation due to creep in an output of a sensor, said sensor apparatus comprising force means arranged for applying a mechanical force to said sensor, said sensor arranged for measuring, in a current measurement, a displacement of said sensor caused by said applied force and a processor component arranged for determining said deformation due to creep for a next measurement by said sensor.

Links: BPP eRegister.

高强度芯片剪切测试工具的改进

EP2473832, WO2011028107, CN102770747, ZL201080049812.5, PCT/NL2010/050545

Self aligning shear tool patented by XYZTEC
Side view self aligning shear tool patented by XYZTEC

一个用于对键合在基座片上半导体芯片剪切测试的测试装置。剪切块能自动对准,采用较软的材料制成,使得测试载荷引起的施加在芯片上的应力最小,从而减小或避免对芯片造成损伤。不同剪切块的设计用于适应不同应用场合,剪切面可以定做,用于测试单个芯片、相距很近的芯片或者堆叠的芯片。剪切面的深度要小于芯片的厚度,以此来保证在测试过程中键合面不会被剪切块损坏。

Product: Self Aligning Shear test solution

Links: Espacenet, Google, EP-register, BPP eRegister.

Solder cleaning system

WO2016012357, PCT/EP2015/066389, CN2017022201023170, GB20140013225

The present invention provides a method of cleaning solder from the jaws of a solder ball test device. The method comprising the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated gas over the jaws of a solder ball test device to remove solder from said jaws. An apparatus which for carrying out the method is also disclosed.

Product: CBP Cavity Cleaner

Links: Espacenet, Google, Patentscope

Other patents

Several other XYZTEC patents have not been published yet.


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