Presentation at CSPT 2017 by Bob Sykes

2017年6月23日

Bob Sykes presenting at CSPT 2017: Recent and Future Advances in Bond TestingBob Sykes presenting at CSPT 2017: Recent and Future Advances in Bond Testing

For the second year in a row, XYZTEC CTO Bob Sykes was invited to speak at China Semiconductor Packaging Test Symposium (CSPT). Hundreds of visitors attended the presentation on "Recent and Future Advances in Bond Testing". The audience among which many leading corporations that employ bond testing was very interested in the subjects presented.

The audience among which many leading corporations that employ bond testing was very interested in the subjects presented by Bob Sykes, XYZTECThe audience among which many leading corporations that employ bond testing was very interested in the subjects presented by Bob Sykes, XYZTEC

Among the presented topics were the current state of technology in vision analysis and illumination, coating and film testing and XYZTEC's brand new lead frame handler.

Large crowd awaiting the presentation by Bob Sykes at CSPT 2017Large crowd awaiting the presentation by Bob Sykes at CSPT 2017

CSPT is a professional conference that focuses on Semiconductor Packaging & Testing. It was held for the 15th time, this time in Jiangyin, China. Directed by Department of Electronics Information, the Ministry of Industry and Information Technology of the People’s Republic of China and Chinese Institute of Electronics is organized by China Semiconductor Industry Association.

XYZTEC booth at CSPT 2017XYZTEC booth at CSPT 2017

Bob Sykes, CTO of XYZTEC, is one of the leading authorities in bond testing world wide.

Click here to apply for a bond testing seminar.


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