Automation features draw attention at Semicon Taiwan 2016


XYZTEC distributor SST at TWTC Nangang Hall (4F) booth 824
XYZTEC distributor SST at TWTC Nangang Hall (4F) booth 824

This week, XYZTEC is exhibiting the Condor Sigma at Semicon Taiwan. With two booths at the central TWTC Nangang Hall (4F), the market leader in bond testing is attracting a lot of attention. Many customers are automating their facilities and therefore come to see the latest advances in automation that the Condor Sigma and the 300mm (12 inch) wafer testing Condor Sigma W12 have to offer.

The unique solutions for wafer handler (EFEM) integration, the highly effective warped wafer pusher and the patented contactless CBP Jaw Cleaner prove to be the most popular features that help semiconductor companies to improve their throughput and efficiency.

XYZTEC distributor Kingyoup at TWTC Nangang Hall (4F) booth 852
XYZTEC distributor Kingyoup at TWTC Nangang Hall (4F) booth 852

The show at the Taipei Nangang Exhibition Center in Taiwan is expected to attract 43,000 visitors until Friday September 9th, 4PM. Everyone with an interest in bond testing is invited to come to one of our booths and see the Condor Sigma in action.


2019年12月 Xyztec faces any challenge
2019年7月 Meet the world’s biggest bond testers
2019年4月 Free SMTconnect ticket? Register now
2018年8月 Is Fully Automatic Bond Testing Possible?
2017年7月 Advances in Thin, 3D and MEMS Die Bond Strength Testing
2017年5月 Shear testing copper pillar
2017年3月 Fracture strength of thin wafers and die
2017年2月 Centralized database for enhanced security and SPC options
2017年1月 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
2016年12月 Coating and film testing
2016年11月 Latest software release enables automatic grading
2016年10月 Vision enhanced materials testing

Click to subscribe.

Other news

XYZTEC Newsletter

订阅XYZTEC 最新的技术摘要



Code image

Please type the code above (refresh code) here:

© 1999-2016 XYZTEC BV Disclaimer, Privacy, Cookies
Technology leader in bond testing worldwide