Successful ESTC Conference in Dresden, Germany

2018年9月20日

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. XYZTEC, technology leader in bond testing, was present to discuss and share information about fully automated bond testing.

This international Electronics System-Integration Technology event brought together both acedemics as the industry leaders to present and discuss trends in packaging and integration technologies. More than 400 engineers and managers from all areas of the microelectronics and system integration industry were at this event.

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

最新的技术摘要

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