One of our goals as technology leader in bond testing is “global presence and local support”. The key to this success is to spread knowledge through our annual sales and services meetings.
This week, XYZTEC held the sales and service training in Bangkok to share our knowledge with our Asian partners. Over 30 sales and service engineers from Greater China, Japan and the rest of Asia Pacific participated in this interactive training in Bangkok.
As always, the meeting included a technology update. This year several software updates concern automated testing and automatic analysis. Furthermore, the relevant sales and service details on the latest XYZTEC bond tester platforms capable of testing high forces and large working areas with extreme precision were uncovered.
The XYZTEC Sigma HF is capable of applying accurate rotational shear, pull and push forces for forces up to 1000 kgf, for example for high power devices. Similar bond testers, the Sigma L and Sigma XL, are extremely relevant for applications requiring larger working areas, with forces up to 200 kgf using our state of art Revolving Measurement Unit (RMU). More information about these bond testers will follow very soon. Come and see the new version of our High Force bond tester at the SMTconnect in Nuremberg in the second week of May.
Successful sales stories were shared among distributors, the latest innovations on the Sigma MAG, also available with safety cabinet, were discussed and our partners had the opportunity to update their skills and knowledge. The training was productive and fun and our partners are ready to provide our customers the best support at all times!
|2019年7月||Meet the world’s biggest bond testers|
|2019年4月||Free SMTconnect ticket? Register now|
|2018年8月||Is Fully Automatic Bond Testing Possible?|
|2017年7月||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|2017年5月||Shear testing copper pillar|
|2017年3月||Fracture strength of thin wafers and die|
|2017年2月||Centralized database for enhanced security and SPC options|
|2017年1月||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|2016年12月||Coating and film testing|
|2016年11月||Latest software release enables automatic grading|
|2016年10月||Vision enhanced materials testing|
|2016年9月||XYZTEC makes lid pull easy|
|7月5日||Teaming up with Micronnect B.V. and BRIDGE S.r.l.|
|5月7日||Newest Sigma HF High Force bond tester live in action at SMTconnect|
|4月26日||XYZTEC spreads bond testing knowledge to partners worldwide|
|3月20日||Visit us at Semicon China|
|1月29日||XYZTEC at Semicon Korea|
|11月21日||Presentation at CSPT 2018|
|11月15日||Matelec show 2018 for the Electrical and Electronics Industry with Antycip|
|9月20日||Successful ESTC Conference in Dresden, Germany|
|7月11日||LEGO® for Nepal sponsored by XYZTEC|
|6月5日||Visit us at SMT Hybrid Packaging Nuremberg|
|4月20日||Smart LED and Solar panels for XYZTEC head office|
|4月18日||XYZTEC workshop at IMAPS UK|
|3月16日||ODEOM shows Condor Sigma in Istanbul|
|3月15日||Semicon China under way|
|1月31日||Condor Sigma W12 at Semicon Korea|
|12月4日||Condor Sigma stars in Audi Tech Day video|
|10月23日||Award for First Technology China|
|7月19日||XYZTEC granted subsidy for further accuracy improvements|
|6月23日||Presentation at CSPT 2017 by Bob Sykes|
|6月6日||Condor Sigma in São Paulo, Brazil|
|5月16日||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|
|4月28日||Semicon Penang 2017 successful|
|4月28日||Pizza and Go cart racing at K1 Speed in Northern CA|