XYZTEC introduced an electronic newsletter today. 订阅XYZTEC 最新的技术摘要 and stay up to date about everything related to bond testing and our latest developments. The first newsletter is centered around our new 300mm wafer testing machine, the Condor Sigma W12:
The Condor Sigma W12 is based on XYZTEC’s market leading Condor Sigma platform. It shares many of the same features that set the Condor Sigma apart from the rest of the industry. The W12’s performance has been further enhanced for the precision and handling requirements of wafer testing.
The W12 is designed to test any wafer size up to 300mm. Switching from various wafer sizes is a simple procedure. The goal was to minimize downtime for companies that have multiple wafer diameters. Many test types are possible on the Sigma W12. The most common include solder ball shear and Cold Bump Pull (CBP) testing. XYZTEC’s latest development is Pull Testing solder bumps on copper pillars. XYZTEC also offers solutions for wire bonds on wafer. With the widest range of sensors and tooling there is something to suit almost any bond test application.
All of XYZTEC’s axis movements are controlled with linear encoders. This technology provides unrivalled accuracy and it offers a significant improvement compared with rotary encoder solutions found on other equipment.
Whether you are using the system in the manual or automatic mode, intelligent axis speed control of up to 50mm/s enables the fastest traverse time over long distances. However, the W12 employs an automatic slow down feature as the tool approaches the target. This feature ensures precision and safety. Set up time is minimal. Wafer-map import capability provides accurate and rapid data transfer of the bonds to be tested. Other production functions include; onboard barcode reading and SPC data down load.
The Sigma W12 offers stand-alone manual loading or it can be fully integrated with wafer loaders/un-loaders. With the optional rotary table feature, wafer orientation can be accomplished quickly and accurately using manual or automatic functionality. A range of vacuum chucks and pin transfer options enable the handling of the most challenging of wafers.
A range of onboard camera options enable high magnification images of the failure mode. These can be saved along with the test data either automatically or under operator control.
A debris collection option manages the debris resulting from test. Options include a programmable timed-pulse from an air jet to dislodge loose material from the test area, as well as a material vacuum pickup that captures loose material in a collection filter.
|2019年7月||Meet the world’s biggest bond testers|
|2019年4月||Free SMTconnect ticket? Register now|
|2018年8月||Is Fully Automatic Bond Testing Possible?|
|2017年7月||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|2017年5月||Shear testing copper pillar|
|2017年3月||Fracture strength of thin wafers and die|
|2017年2月||Centralized database for enhanced security and SPC options|
|2017年1月||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|2016年12月||Coating and film testing|
|2016年11月||Latest software release enables automatic grading|
|2016年10月||Vision enhanced materials testing|
|2016年9月||XYZTEC makes lid pull easy|
|7月5日||Teaming up with Micronnect B.V. and BRIDGE S.r.l.|
|5月7日||Newest Sigma HF High Force bond tester live in action at SMTconnect|
|4月26日||XYZTEC spreads bond testing knowledge to partners worldwide|
|3月20日||Visit us at Semicon China|
|1月29日||XYZTEC at Semicon Korea|
|11月21日||Presentation at CSPT 2018|
|11月15日||Matelec show 2018 for the Electrical and Electronics Industry with Antycip|
|9月20日||Successful ESTC Conference in Dresden, Germany|
|7月11日||LEGO® for Nepal sponsored by XYZTEC|
|6月5日||Visit us at SMT Hybrid Packaging Nuremberg|
|4月20日||Smart LED and Solar panels for XYZTEC head office|
|4月18日||XYZTEC workshop at IMAPS UK|
|3月16日||ODEOM shows Condor Sigma in Istanbul|
|3月15日||Semicon China under way|
|1月31日||Condor Sigma W12 at Semicon Korea|
|12月4日||Condor Sigma stars in Audi Tech Day video|
|10月23日||Award for First Technology China|
|7月19日||XYZTEC granted subsidy for further accuracy improvements|
|6月23日||Presentation at CSPT 2017 by Bob Sykes|
|6月6日||Condor Sigma in São Paulo, Brazil|
|5月16日||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|
|4月28日||Semicon Penang 2017 successful|
|4月28日||Pizza and Go cart racing at K1 Speed in Northern CA|