订阅XYZTEC 最新的技术摘要

2014年9月5日

XYZTEC introduced an electronic newsletter today. 订阅XYZTEC 最新的技术摘要 and stay up to date about everything related to bond testing and our latest developments. The first newsletter is centered around our new 300mm wafer testing machine, the Condor Sigma W12:

Condor Sigma W12
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Sigma W12

The Condor Sigma W12 is based on XYZTEC’s market leading Condor Sigma platform. It shares many of the same features that set the Condor Sigma apart from the rest of the industry. The W12’s performance has been further enhanced for the precision and handling requirements of wafer testing.

Wafer testing up to 300mm

Condor Sigma W12 wafer chuck
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The W12 is designed to test any wafer size up to 300mm. Switching from various wafer sizes is a simple procedure. The goal was to minimize downtime for companies that have multiple wafer diameters. Many test types are possible on the Sigma W12. The most common include solder ball shear and Cold Bump Pull (CBP) testing. XYZTEC’s latest development is Pull Testing solder bumps on copper pillars. XYZTEC also offers solutions for wire bonds on wafer. With the widest range of sensors and tooling there is something to suit almost any bond test application.

Accurate fast full automation

All of XYZTEC’s axis movements are controlled with linear encoders. This technology provides unrivalled accuracy and it offers a significant improvement compared with rotary encoder solutions found on other equipment.

Condor Sigma W12 sideview
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Whether you are using the system in the manual or automatic mode, intelligent axis speed control of up to 50mm/s enables the fastest traverse time over long distances. However, the W12 employs an automatic slow down feature as the tool approaches the target. This feature ensures precision and safety. Set up time is minimal. Wafer-map import capability provides accurate and rapid data transfer of the bonds to be tested. Other production functions include; onboard barcode reading and SPC data down load.

Automatic and manual Load/Unload with warped wafer capability

The Sigma W12 offers stand-alone manual loading or it can be fully integrated with wafer loaders/un-loaders. With the optional rotary table feature, wafer orientation can be accomplished quickly and accurately using manual or automatic functionality. A range of vacuum chucks and pin transfer options enable the handling of the most challenging of wafers.

Failure mode image capture

A range of onboard camera options enable high magnification images of the failure mode. These can be saved along with the test data either automatically or under operator control.

Condor Sigma W12 Blower and Vacuum
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Debris collection

A debris collection option manages the debris resulting from test. Options include a programmable timed-pulse from an air jet to dislodge loose material from the test area, as well as a material vacuum pickup that captures loose material in a collection filter.


最新的技术摘要

2017年7月 Advances in Thin, 3D and MEMS Die Bond Strength Testing
2017年5月 Shear testing copper pillar
2017年3月 Fracture strength of thin wafers and die
2017年2月 Centralized database for enhanced security and SPC options
2017年1月 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
2016年12月 Coating and film testing
2016年11月 Latest software release enables automatic grading
2016年10月 Vision enhanced materials testing
2016年9月 XYZTEC makes lid pull easy
2016年8月 Condor Sigma W12 with large heater stage
2016年7月 How to: Wire Pull
2016年6月 Get 10% off your next tools order

 
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Other news
7月19日 XYZTEC granted subsidy for further accuracy improvements
6月23日 Presentation at CSPT 2017 by Bob Sykes
6月6日 Condor Sigma in São Paulo, Brazil
5月16日 Fully automatic lead frame tester introduced at SMT Hybrid Packaging
4月28日 Semicon Penang 2017 successful
4月28日 Pizza and Go cart racing at K1 Speed in Northern CA
3月14日 XYZTEC赛世铁克在上海新国际博览中心
2月16日 Job opening for Junior Mechanical Design Engineer [closed]
11月29日 Successful seminar in Russia with Sovtest
10月31日 Market leading Condor Sigma bond tester at TPCA Taiwan
9月8日 Automation features draw attention at Semicon Taiwan 2016
6月28日 HTMG represents XYZTEC in South America
6月14日 关于召开 2016 年中国半导体封装测试技术 与市场年会(第十四届)的通知 [UPDATED]
6月14日 Purchase wire hooks, shear tools, tweezer tips by PayPal
5月3日 SMT 2016 all about automation
4月11日 Annual sales and service event in Bangkok big success
3月15日 Come visit us at Semicon China
3月4日 HiSOL new distributor in Japan
3月1日 手机萤幕上的驱动晶片测试
11月13日 ISO-Dynamique and Axend represent XYZTEC in Malaysia, Singapore, Thailand, Indonesia and Vietnam
11月12日 Wire detect functionality popular at Productronica
10月30日 How to: Cold Bump Pull
10月6日 刮痕测试 / 镀膜测试
9月7日 Condor Sigma draws attention at Semicon Taiwan
7月3日 令人振奋的销售和服务曼谷会议


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