How to: Cold Bump Pull

2015年10月30日

We have added an extensive how-to on Cold Bump Pull (CBP) to our website. By doing this we aim to spread knowledge about bond testing in the industry.

Please feel free to use this guide to bond testing and we invite you to let us know if you have any comments or specific questions regarding the application of it to your samples, whether you use our equipment or not.

www.coldbumppull.how

The how-to consists of 12 paragraphs and 7 pages:

  1. Introduction
  2. What is CBP?
  3. What types of balls can be tested?
  4. Objectives
  5. Jaw size
  6. Jaw quality
  7. Setting up and doing a test
    1. Alignment jaw opening and back relief
    2. Jaw alignment in X, Y and Z
    3. Grip force and getting used to X and Y alignment
    4. Closing time
    5. Landing force and alignment height
    6. Optimizing the test
    7. Test speed
  8. XYZTEC USB Tweezers
  9. Test sequence recap
  10. What test force should I expect?
  11. Cleaning the jaws
  12. JEDEC failure mode standards

最新的技术摘要

2019年7月 Meet the world’s biggest bond testers
2019年4月 Free SMTconnect ticket? Register now
2018年8月 Is Fully Automatic Bond Testing Possible?
2017年7月 Advances in Thin, 3D and MEMS Die Bond Strength Testing
2017年5月 Shear testing copper pillar
2017年3月 Fracture strength of thin wafers and die
2017年2月 Centralized database for enhanced security and SPC options
2017年1月 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
2016年12月 Coating and film testing
2016年11月 Latest software release enables automatic grading
2016年10月 Vision enhanced materials testing
2016年9月 XYZTEC makes lid pull easy

 
Click to subscribe.

Other news

XYZTEC Newsletter

订阅XYZTEC 最新的技术摘要

你的大名:

電子郵件地址:

Code image

Please type the code above (refresh code) here:


© 1999-2016 XYZTEC BV Disclaimer, Privacy, Cookies
Technology leader in bond testing worldwide