关于召开 2016 年中国半导体封装测试技术 与市场年会(第十四届)的通知 [UPDATED]

2016年6月14日

The preparations are under way at the XYZTEC booth for CSPT 2016 in Nantong
The preparations are under way at the XYZTEC booth for CSPT 2016 in Nantong

UPDATE: click for a photo of Bob Sykes' keynote speech at CSPT 2016 in Nantong

Tomorrow at around 13:30 local time, XYZTEC CTO Bob Sykes shall hold a keynote speech on "Recent and Future Advances in Bond Testing" at China Semiconductor Packaging Test Symposium (CSPT) in Nantong. More than 800 visitors are expected at this professional conference that focuses on Semiconductor Packaging & Testing.

Exhibitors banner at CSPT 2016 in Nantong, including XYZTEC
Exhibitors banner at CSPT 2016 in Nantong, including XYZTEC

中国半导体封装测试技术与市场年会,是国内唯一涵盖整个半导体封测行业的最权威最具品牌的专业研讨会。大会已经在天水、广州、连云港、成都、苏州、大连、无锡、 深圳、烟台、北京、南京、重庆、西安成功举办过十三届。第十四届年会将由工业和信 息化部电子信息司、中国电子学会指导,中国半导体行业协会主办,由中国半导体行业 协会封装分会和江苏南通苏通科技产业园区承办。第十四届年会将于 2016 年 6 月 15-18 日在江苏南通召开。

Bob Sykes, CTO of XYZTEC, is one of the leading authorities in bond testing world wide.

Keynote speaker Bob Sykes (XYZTEC CTO) at CSPT 2016 in NantongKeynote speaker Bob Sykes (XYZTEC CTO) at CSPT 2016 in Nantong

Update

The keynote speech by Bob Sykes was attended by about 1000 interested visitors. The audience among which many leading corporations that employ bond testing was very interested in the subjects presented. Click here to apply for a bond testing seminar.

Keynote speaker Bob Sykes (XYZTEC CTO) at CSPT 2016 in Nantong delivers speech in front of about 1000 interested visitorsKeynote speaker Bob Sykes (XYZTEC CTO) at CSPT 2016 in Nantong delivers speech in front of about 1000 interested visitors

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