...this is page 4; click here to go to page 3.
The subject of bond testing is far ranging and varied but the value that it contributes to ensuring product quality cannot be overlooked. Precise force displacement measurement using a modern bond tester allows bond strength modeling that can successfully predict the various failure modes and can be used as an accurate prediction model of real life loading conditions.
This article originally appeared in the June 2010 issue of Global SMT & Packaging magazine
Click here for more information about the Condor Sigma bond tester and its unique properties.