为了增进和提供我们客户更多的剪切力测试的知识和解决方案, XYZTEC 赛世铁克安排了一系列的 研讨会 来传递专业知识并以最直接简单的方式来简报. 每一场的 研讨会 都是专注在剪切力测试原理的特定题目.
The XYZTEC expert holds an informative presentation and invites the attendees to participate by asking questions and sharing their thoughts and experience on the subject. Additionally, every seminar provides the opportunity for your quality control engineers to discuss any bond testing challenges that your company is facing with the XYZTEC experts.
Currently, we have composed 7 different bond testing seminar modules, each containing multiple sections:
The seminars are held in various locations all over the world. The series presents networking opportunities, attracting a broad spectrum of attendees. However, XYZTEC is open to organize dedicated sessions for interested customers, depending on the demand and schedule.
ECTC Las Vegas 2019 (IEEE 69th)
IMS Boston 2019
IMAPS SIP USA 2019
CIOE China 2019
EMPC Italy 2019
Semicon Taiwan 2019
IMAPS USA 2019
Productronica Germany 2019