Bob Sykes presenting at a bond testing seminar
Bob Sykes presenting at a bond testing seminar

Bond testing seminars

Speak with the experts

为了增进和提供我们客户更多的剪切力测试的知识和解决方案, XYZTEC 赛世铁克安排了一系列的 研讨会 来传递专业知识并以最直接简单的方式来简报. 每一场的 研讨会 都是专注在剪切力测试原理的特定题目.

The XYZTEC expert holds an informative presentation and invites the attendees to participate by asking questions and sharing their thoughts and experience on the subject. Additionally, every seminar provides the opportunity for your quality control engineers to discuss any bond testing challenges that your company is facing with the XYZTEC experts.

Seven modules

Currently, we have composed 7 different bond testing seminar modules, each containing multiple sections:

  • 1 推拉力测试原理
    • 1.1 推拉力测试的目标
    • 1.2 基本推拉力测试的参数和资料产出
  • The science of bond testing. The
    The science of bond testing. The 'golden rules of bond testing' (seminar 1.1) provide good rules of thumb to set up the best test for your product
  • 2 操作
    • 2.1 拉力测试
    • 2.2 推力测试
    • 2.3 特别测试
    • 2.4 推拉力测试的环境
  • 3 资料
    • 3.1 测量结果
    • 3.2 统计
  • 4 效能
    • 4.1 感测器精度
    • 4.2 各轴精度
    • 4.3 测试位移距离和速度的精度
  • 5 显微镜, 摄像头, 照明装置
    • 5.1 显微镜
    • 5.2 摄像头
  • 6 全自动化测试
    • 6.1 全自动化测试原理
    • 6.2 全自动化的程序测试
  • 7 系统设计
    • 7.1 测试样品的夹持/夹具
    • 7.2 人体工学设计
    • 7.3 简易操作设计
    • 7.4 应用的范围
    • 7.5 传感器
A slide from bond testing module 1.1: Bond testing objectives
A slide from bond testing module 1.1: Bond testing objectives

When and where

The seminars are held in various locations all over the world. The series presents networking opportunities, attracting a broad spectrum of attendees. However, XYZTEC is open to organize dedicated sessions for interested customers, depending on the demand and schedule.

To find out whether any seminar is scheduled in your area or to request a private session, please contact us. Because of the popular demand we cannot fulfill every request.

How to test bonds?

Click here to go to this website's extensive how-to section. We currently offer how-to's on Cold Bump Pull (CBP), Wire Pull (WP) and Tweezer Pull (TP) and much more.


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Events

2019年

11月12..15日 
Productronica Germany 2019
11月19..21日 
Sensors Symposium 2019
11月27..29日 
MWE 2019
12月11..13日 
Semicon Japan 2019

2020年

1月15..17日 
InterNepcon Japan 2020
1月29..31日 
MEMS SENSING & NETWORK 2020
2月18..19日 
EBL Germany 2020
3月3..5日 
IMAPS Device Packaging 2020
3月18..20日 
Productronica China 2020
3月18..20日 
Semicon China 2020
3月24..26日 
Adhesives & Bonding Expo 2020
4月16..17日 
PSIC China 2020
5月5..7日 
SMTconnect 2020
5月26..29日 
ECTC 2020
5月27..29日 
JPCA Show 2020
9月9..11日 
CIOE 2020
9月15..17日 
The Battery Show 2020
9月23..25日 
Semicon Taiwan 2020
10月6..8日 
IMAPS USA 2020
10月21..23日 
Nepcon Nagoya 2020
11月25..27日 
MWE 2020
12月16..18日 
Semicon Japan 2020


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XYZTEC CTO Bob Sykes at CSPT 2017
XYZTEC CTO Bob Sykes at CSPT 2017

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