在半导体电子业, 保持高品质的镀膜和镀层是一件很重要的要求. XYZTEC “刮痕测试＂(PDF) 提供一个新的方法来量测黏胶层, 不论是在基板或其他材料的单一层或多层镀膜. 就如影片所展示, 特制的推刀被使用于接触在单一层或多层镀膜.
并沿着镀膜表面执行刮痕测试. Another excellent solution is to use a diamond Nano Indenter tip.
被切入和刮入的测试深度, 可以被可程式化的接触力设定来控制. 因此有能力将推刀压入单一层或多层镀膜到可程式化控制的深度. 薄弱的连结层可以从该层的失效模式, 推刀的力与位移曲线图被观察出来. 在这个范例中展示好的和坏的连结层, 可以轻易被观察出来.
There are three standard procedures for scratch testing;
As with any scratch tester the quality of the bond between layers can be seen in the failure mode and force displacement graph. The examples in the picture below show the same PLST on multi layer films of different constructions.
Additional failure mode analysis such as EDX helps to show at what point layers fail. With this deeper understanding quality assurance may subsequently only require scratch testing.
The Condor Sigma is a highly flexible micro materials tester specifically designed for the semiconductor and electronics industry. From its very beginning it was designed for easy and comfortable manual use, making it much faster than any dedicated scratch tester.
Its fully automatic mode delivers even more benefit. Samples are simply loaded and tested. The Sigma has fiducial mark pattern recognition to locate the samples position and then tests with precision with whatever combination of scratch tests you want. These can be different positions, procedures, directions and speeds. Being automatic, every sample is tested in exactly the same way.
In a recent application, a product that required 1 day to test takes a mere 2 minutes on the Condor Sigma!
Please contact us if you have any questions or special bond testing requirements.
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