During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements.
Cleaning the cavities is very difficult and small ball cavities can be damaged easily.
XYZTEC has developed a contactless cavity cleaner with a high temperature and high pressure air jet that melts the solder and then blows it away. The video below shows it working on 300µm and 80µm solder ball cavities:
This system is the subject of XYZTEC patent application 1413225.2 (filed in the United Kingdom).
Click here to download the Sigma brochures:
To find your local representative, please select a region:
Micro drives with the 'strength of a giant' class='zwart'>Click here to download an article by Micro drives with the 'strength of a giant'>Faulhaber, called "Micro drives with the 'strength of a giant'>Mechanical stress test for component solder joints and bonding wires - Micro drives with the 'strength of a giant'" (PDF) on the USB Tweezers.