BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Xyztec - ECPv6.17.3//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://www.xyztec.com/de/
X-WR-CALDESC:Veranstaltungen für Xyztec
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20250101T000000
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BEGIN:VEVENT
DTSTART;TZID=UTC:20260805T080000
DTEND;TZID=UTC:20260807T170000
DTSTAMP:20260806T072812Z
CREATED:20260730T092308Z
LAST-MODIFIED:20260806T072812Z
UID:75454-1785916800-1786122000@www.xyztec.com
SUMMARY:ICEPT
DESCRIPTION:ICEPT (China International Conference on Electronic Packaging Technology) has long been a representative academic and technical exchange platform in the global electronic packaging field and is also regarded as an important international event by the industry. This conference is expected to gather globally renowned wafer fabs\, OSAT packaging and testing plants\, advanced packaging supply chain\, and high-end equipment enterprises\, as well as multiple research institutes\, to jointly showcase the latest developments in 2.5D/3D packaging\, Chiplet integration\, interconnect technology\, and reliability testing.\n  \nIn the field of advanced packaging and microelectronic mechanics testing\, xyztec is well recognized in both the global and Chinese markets. Its push-pull testing equipment and automation technology continue to provide key support for the reliability verification of Chiplets and heterogeneous integrated components.\n  \nDuring ICEPT 2026\, xyztec will collaborate with its core agent in China\, ExTripod\, to publicly demonstrate its fully automatic push-pull force testing equipment. Live demonstrations will showcase high-precision automated testing capabilities for micro solder joint pull (Wire/Bump Pull) and chip push (Die Shear) applications\, assisting sealing and testing operators in improving reliability verification efficiency and process control accuracy.\n  \nYou are welcome to visit our booth and learn more about our latest bond testing solutions.
URL:https://www.xyztec.com/de/event/icept/
LOCATION:Xi’an\, China\, Xi'an\, China
ATTACH;FMTTYPE=image/jpeg:https://www.xyztec.com/wp-content/uploads/2026/07/IMG_2346-2-scaled.jpg
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