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DTSTART;VALUE=DATE:20220531
DTEND;VALUE=DATE:20220604
DTSTAMP:20260529T192141
CREATED:20220211T090527Z
LAST-MODIFIED:20230525T065020Z
UID:34991-1653955200-1654300799@www.xyztec.com
SUMMARY:ECTC San Diego 2022
DESCRIPTION:A Premier Event…. \nThe Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging\, components and microelectronic systems science\, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). \nThe technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging\, modeling and simulation\, Photonics\, interconnections\, materials and processing\, applied reliability\, assembly and manufacturing technology\, components and RF\, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards. \nThe Panel\, Plenary\, Special Sessions\, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders. \nThe ECTC would not be possible without the sponsorship of the IEEE Electronics Packaging Society (formerly CPMT)\, numerous corporate participants and sponsors\, and the time and energy of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.
URL:https://www.xyztec.com/de/event/ectc-san-diego-2022/
LOCATION:The Sheraton San Diego Hotel and Marina\, 1380 Harbor Island Drive\, San Diego\, CA\, CA 92101\, United States
CATEGORIES:Trade Fair
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20220608
DTEND;VALUE=DATE:20220611
DTSTAMP:20260529T192141
CREATED:20220512T082504Z
LAST-MODIFIED:20230525T064745Z
UID:37226-1654646400-1654905599@www.xyztec.com
SUMMARY:PSIC 2022
DESCRIPTION:PowerSemiconductorinternational conference 2022 – China 5th International New Energy Auto Power semiconductor technology Forum
URL:https://www.xyztec.com/de/event/psic-2022/
LOCATION:Wuhu Conch International Conference Center
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20220614
DTEND;VALUE=DATE:20220616
DTSTAMP:20260529T192141
CREATED:20220201T114113Z
LAST-MODIFIED:20230525T064741Z
UID:34781-1655164800-1655337599@www.xyztec.com
SUMMARY:EBL 2022
DESCRIPTION:11. DVS/GMM-Fachtagung\nDaten – Fluch oder Segen? \nBegriffe wie „Data-Mining\, Cloud Solutions\, Atrtificial Intelligence (künstliche Intelligenz)“ etc. sind heute aus dem Zeitalter der Digitalen Transformation nicht mehr weg zu denken. So ist es kein Geheimnis\, dass in der modernen Baugruppentechnologie riesige Datenmengen anfallen. Bereits bei der Entwicklung und Konstruktion\, der Materialbeschaffung und Lagerung\, während der Fertigung\, in der Qualitätskontrolle\, beim Vertrieb und beim Anwender werden hier mit allen Kräften Daten generiert. Die Digitalisierung hat es möglich gemacht\, diese Datenmengen zu erfassen\, schnell weiterzuleiten und zu sammeln. Aber was machen wir mit diesen Daten? \nDieser oder ähnlichen Fragen will die 11. DVS/GMM-Fachtagung auf dem Gebiet der elektronischen Baugruppen und Leiterplatten nachgehen und zur Diskussion anregen. \nWir sind auf Ihre Beiträge gespannt und freuen uns darauf\, Sie 2022 in Fellbach zu treffen.
URL:https://www.xyztec.com/de/event/ebl-2022/
LOCATION:Schwabenlandhalle Fellbach\, Guntram-Palm-Platz 1\, Fellbach\, 70734\, Germany
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20220628
DTEND;VALUE=DATE:20220701
DTSTAMP:20260529T192141
CREATED:20220422T072348Z
LAST-MODIFIED:20230525T064729Z
UID:37052-1656374400-1656633599@www.xyztec.com
SUMMARY:Adhesives and Bonding Expo (ABX)
DESCRIPTION:Adhesives & Bonding Expo\, and the co-located Foam Expo\, is a unique opportunity to meet the entire adhesives and bonding supply chain and source high-performing material bonding technologies\, including surface treatment\, curing\, bond inspection and all adhesive formulations. Learn about new market opportunities\, the latest bonding processes for binding any material\, and automated systems that enable robust and precise material bonding in modern assembly lines. \nThe conference at Adhesives & Bonding Expo will offer expert insights from high-level technical representatives from across the adhesives and foam markets\, equipping you with the knowledge to get ahead of the industry curve and stay ahead of your competitors.
URL:https://www.xyztec.com/de/event/adhesives-and-bonding-expo-abx/
LOCATION:Novi Michigan\, 46100 Grand River Ave Novi\, 48374\, United States
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