BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Xyztec - ECPv6.17.4.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://www.xyztec.com/de/
X-WR-CALDESC:Veranstaltungen für Xyztec
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
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TZID:UTC
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TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20250101T000000
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BEGIN:VEVENT
DTSTART;TZID=UTC:20260805T080000
DTEND;TZID=UTC:20260807T170000
DTSTAMP:20260806T072812Z
CREATED:20260730T092308Z
LAST-MODIFIED:20260806T072812Z
UID:75454-1785916800-1786122000@www.xyztec.com
SUMMARY:ICEPT
DESCRIPTION:ICEPT (China International Conference on Electronic Packaging Technology) has long been a representative academic and technical exchange platform in the global electronic packaging field and is also regarded as an important international event by the industry. This conference is expected to gather globally renowned wafer fabs\, OSAT packaging and testing plants\, advanced packaging supply chain\, and high-end equipment enterprises\, as well as multiple research institutes\, to jointly showcase the latest developments in 2.5D/3D packaging\, Chiplet integration\, interconnect technology\, and reliability testing.\n  \nIn the field of advanced packaging and microelectronic mechanics testing\, xyztec is well recognized in both the global and Chinese markets. Its push-pull testing equipment and automation technology continue to provide key support for the reliability verification of Chiplets and heterogeneous integrated components.\n  \nDuring ICEPT 2026\, xyztec will collaborate with its core agent in China\, ExTripod\, to publicly demonstrate its fully automatic push-pull force testing equipment. Live demonstrations will showcase high-precision automated testing capabilities for micro solder joint pull (Wire/Bump Pull) and chip push (Die Shear) applications\, assisting sealing and testing operators in improving reliability verification efficiency and process control accuracy.\n  \nYou are welcome to visit our booth and learn more about our latest bond testing solutions.
URL:https://www.xyztec.com/de/event/icept/
LOCATION:Xi’an\, China\, Xi'an\, China
ATTACH;FMTTYPE=image/jpeg:https://www.xyztec.com/wp-content/uploads/2026/07/IMG_2346-2-scaled.jpg
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BEGIN:VEVENT
DTSTART;TZID=UTC:20260826T080000
DTEND;TZID=UTC:20260828T170000
DTSTAMP:20260730T095058Z
CREATED:20251221T060410Z
LAST-MODIFIED:20260730T095058Z
UID:74203-1787731200-1787936400@www.xyztec.com
SUMMARY:PCIM Asia
DESCRIPTION:PCIM Asia Shenzhen 2026\, as an annual event for power electronics\, smart sports\, and renewable energy management that has been deeply rooted in Asia for more than 20 years\, is the core link connecting the industry chain with cutting-edge scientific research achievements.\nThis exhibition focuses on high-value application areas such as SiC/GaN wide ban charged crystals\, power transistor components and modules\, automotive electronics/new energy vehicles\, and electrified transportation industry chains.\n  \nIn the field of power transistor and automotive grade device packaging and testing\, xyztec has always maintained a leading position in the global and Chinese markets with its powerful high thrust/high tensile testing technology\, ultra-high reproducibility accuracy\, and ultimate automation integration capabilities\, setting an industry benchmark for the packaging reliability of power modules.\n  \nAt the PCIM Asia Shenzhen 2026 site\, xyztec will collaborate with its important agent in China\, ExTripod\, to publicly showcase its flagship fully automatic push-pull force testing equipment.\nA dynamic demonstration will be conducted on site to demonstrate an efficient automated push-pull force testing solution for power modules\, including thick aluminum wire/copper strip tension\, as well as high-force die shear testing. The demonstration will highlight how these solutions effectively address the quality control challenges associated with high-power device manufacturing.\n  \nYou are welcome to visit our booth and learn more about our latest bond testing solutions.
URL:https://www.xyztec.com/de/event/pcim-asia/
LOCATION:Shenzhen World Exhibition & Convention Center (Bao’an Venue)\, China\, Hall 16\, Shenzhen\, China
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