Successful ESTC Conference in Dresden, Germany

20 September 2018

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. XYZTEC, technology leader in bond testing, was present to discuss and share information about fully automated bond testing.

This international Electronics System-Integration Technology event brought together both acedemics as the industry leaders to present and discuss trends in packaging and integration technologies. More than 400 engineers and managers from all areas of the microelectronics and system integration industry were at this event.

XYZTEC at ESTC conference in Dresden, GermanyXYZTEC at ESTC conference in Dresden, Germany

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Nov 2016 Latest software release enables automatic grading
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