News archive

02 March 2020 EPIC invests in XYZTEC’s most advanced bond tester
17 January 2020 Visit us in Tokyo this month
13 November 2019 Visit us at Productronica in München
03 October 2019 Xyztec at EuWoRel Berlin
18 September 2019 Sigma and Magazine Loader in action at Semicon Taiwan
17 September 2019 Xyztec at EMPC conference in Pisa
04 September 2019 Meet us worldwide in September
05 July 2019 Teaming up with Micronnect B.V. and BRIDGE S.r.l.
07 May 2019 Newest Sigma HF High Force bond tester live in action at SMTconnect
26 April 2019 XYZTEC spreads bond testing knowledge to partners worldwide
20 March 2019 Visit us at Semicon China
29 January 2019 XYZTEC at Semicon Korea
21 November 2018 Presentation at CSPT 2018
15 November 2018 Matelec show 2018 for the Electrical and Electronics Industry with Antycip
20 September 2018 Successful ESTC Conference in Dresden, Germany
11 July 2018 LEGO® for Nepal sponsored by XYZTEC
05 June 2018 Visit us at SMT Hybrid Packaging Nuremberg
20 April 2018 Smart LED and Solar panels for XYZTEC head office
18 April 2018 XYZTEC workshop at IMAPS UK
16 March 2018 ODEOM shows Condor Sigma in Istanbul
15 March 2018 Semicon China under way
31 January 2018 Condor Sigma W12 at Semicon Korea
04 December 2017 Condor Sigma stars in Audi Tech Day video
10 November 2017 Raysun to represent XYZTEC in China
23 October 2017 Award for First Technology China
25 July 2017 Stelle: Internationaler Sales Manager (m/w)
19 July 2017 XYZTEC granted subsidy for further accuracy improvements
23 June 2017 Presentation at CSPT 2017 by Bob Sykes
06 June 2017 Condor Sigma in São Paulo, Brazil
16 May 2017 Fully automatic lead frame tester introduced at SMT Hybrid Packaging
28 April 2017 Semicon Penang 2017 successful
28 April 2017 Pizza and Go cart racing at K1 Speed in Northern CA
14 March 2017 Visit us at Semicon China
16 February 2017 Job opening for Junior Mechanical Design Engineer [closed]
29 November 2016 Successful seminar in Russia with Sovtest
31 October 2016 Market leading Condor Sigma bond tester at TPCA Taiwan
08 September 2016 Automation features draw attention at Semicon Taiwan 2016
28 June 2016 HTMG represents XYZTEC in South America
14 June 2016 Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT) [UPDATED]
14 June 2016 Purchase wire hooks, shear tools, tweezer tips by PayPal
03 May 2016 SMT 2016 all about automation
11 April 2016 Annual sales and service event in Bangkok big success
15 March 2016 Come visit us at Semicon China
04 March 2016 HiSOL new distributor in Japan
01 March 2016 Cellphone display LCD driver IC testing
13 November 2015 ISO-Dynamique and Axend represent XYZTEC in Malaysia, Singapore, Thailand, Indonesia and Vietnam
12 November 2015 Wire detect functionality popular at Productronica
30 October 2015 How to: Cold Bump Pull
07 September 2015 Condor Sigma draws attention at Semicon Taiwan
03 July 2015 Exciting sales and service meeting in Bangkok
01 July 2015 Bond Test Measurement Accuracy
17 June 2015 Condor Sigma software now available in Vietnamese
06 May 2015 Automatic wire detection draws attention at SMT 2015
26 March 2015 SST joins XYZTEC in Taiwan and mainland China
11 March 2015 More on loop height testing
30 December 2014 BaiTech to represent XYZTEC in Southern California, Tijuana Mexico
19 December 2014 Copper pillar testing
05 September 2014 Subscribe to the XYZTEC newsletter
14 July 2014 Increase your knowledge about bond testing and visit a bond testing seminar
18 June 2014 Successful distributor training during XYZTEC week
01 June 2014 Highlighted: Condor Sigma W12 for 300mm wafer testing
23 May 2014 XYZTEC shows full automation on the Condor Sigma at the SMT 2014 in Nürnberg
21 May 2014 Advances in tweezer pull testing
19 May 2014 Maestro payment method accepted in webshop
17 March 2014 XYZTEC launches webshop for consumables
06 February 2014 ODEOM new distributor for Turkey
13 November 2013 Condor Sigma attracts attention at Productronica
29 October 2013 XYZTEC Sales Director Dirk Schade joins the IMAPS board
08 October 2013 Antycip Technologies new distributor for France, Spain, Portugal and North Africa
03 October 2013 Busy IMAPS show in Orlando, Florida
02 October 2013 Creep test
01 October 2013 SMD shear test
30 September 2013 Spring rigidity test
31 July 2013 New Condor Sigma videos available
03 July 2013 Condor Sigma celebrated at Red Dot Gala
18 June 2013 Visit us at PCIM Asia in Shanghai
22 April 2013 A bond tester that can grow with your company
02 April 2013 Condor Sigma wins Red Dot design award 2013
20 March 2013 Condor Sigma draws attention at Semicon China
11 March 2013 Condor Sigma Vision solutions
20 February 2013 3H Corporation new distributor in Korea
07 February 2013 Heraeus: XYZTEC class A supplier
02 January 2013 Crockett Southwest new XYZTEC sales partner in Texas, Oklahoma, Louisiana and Arkansas
26 October 2012 GIO Award for Condor Sigma
24 October 2012 Alternative Testing Methods for Electronic Assemblies
10 October 2012 USB Tweezers: a unique electrically actuated micro grippers solution
01 October 2012 NW Test Solutions to represent XYZTEC in Pacific Northwest
20 September 2012 Condor Sigma nominated for European Aluminium Award 2012
04 September 2012 Visit us at Semicon Taiwan 2012 in Taipei
25 July 2012 New uni-axial bending test for ultra-thin die
13 July 2012 Busy first show for Tom Haley
02 July 2012 XYZTEC welcomes new sales manager for United States and Canada
02 June 2012 Condor Sigma at Dutch Technology Week 2012
01 June 2012 Condor Sigma attracts attention on ECTC 2012
12 March 2012 High interest in self-alignment tool on Fraunhofer Technology Day
08 February 2012 Introduction of Sigma at Semicon Korea
18 January 2012 Condor Sigma in Japan
22 December 2011 Interelec Electronics AG switches to XYZTEC
08 December 2011 Successful seminar at Tianjin University on Packaging High-temperature Electronics
15 November 2011 Condor Sigma: Performance and Flexibility
06 September 2011 New test method for mechanical strength evaluation of solar cell solder joints
28 June 2011 Case studies: Danfoss, flexibility and deep access
14 June 2011 Fully automated LED wafer testing
08 April 2011 Employees donate to Japan relief effort
04 March 2011 XYZTEC participates in Solar Module Value Chain for International BIPV Concepts
06 January 2011 XYZTEC proudly presents its Korean website
06 December 2010 Aubert Dupont speaks at IEEE CPMT 2010
11 November 2010 XYZTEC launches new website
05 September 2010 Charity event for RETT syndrome big success
01 July 2010 Technical Informer: USB Tweezers
09 March 2010 XYZTEC introduces Condor EZ: the next generation in bond testing
26 January 2010 Technical Informer: Solar Cell Ribbon Peel Testing
09 March 2009 Bob Sykes wechselt zu XYZTEC

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XYZTEC Newsletter


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December 2019 Xyztec faces any challenge
July 2019 Meet the world’s biggest bond testers
April 2019 Free SMTconnect ticket? Register now
August 2018 Is Fully Automatic Bond Testing Possible?
July 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
May 2017 Shear testing copper pillar
March 2017 Fracture strength of thin wafers and die
February 2017 Centralized database for enhanced security and SPC options
January 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
December 2016 Coating and film testing
November 2016 Latest software release enables automatic grading
October 2016 Vision enhanced materials testing
September 2016 XYZTEC makes lid pull easy
August 2016 Condor Sigma W12 with large heater stage
July 2016 How to: Wire Pull
June 2016 Get 10% off your next tools order
May 2016 Pull testing bumped wafers
April 2016 SMD gull wing leads testing
March 2016 Automation: matrix bond testing made easy
February 2016 Fully integrated solution for automated wafer testing
January 2016 In bond testing, size does matter
December 2015 XYZTEC goes from strength to strength
November 2015 Automatic wire detect
October 2015 Highly reproducible stud pull tests are possible
September 2015 What is the quality of your coatings?
August 2015 Loading samples has never been so easy
July 2015 Axis accuracy of ±1µm: essential for automatic bond testing
June 2015 Increase your bondtesting throughput
May 2015 USB Tweezers
March 2015 Analyze not only forces but also distances on your product
February 2015 Technology leader XYZTEC raises the bar in bond testing once again with new software release
January 2015 Why all bond testers should have an RMU
December 2014 Copper pillar testing
November 2014 Is process verification important to your business?
October 2014 Fully automated bond tester
September 2014 Ideal solution for 300mm (12 inch) wafer testing

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