{"id":10312,"date":"2010-12-06T13:33:39","date_gmt":"2010-12-06T12:33:39","guid":{"rendered":"https:\/\/www.xyztec.com\/?p=10312"},"modified":"2010-12-06T13:33:39","modified_gmt":"2010-12-06T12:33:39","slug":"aubert-dupont-speaks-at-ieee-cpmt-2010","status":"publish","type":"post","link":"https:\/\/www.xyztec.com\/de\/aubert-dupont-speaks-at-ieee-cpmt-2010\/","title":{"rendered":"Aubert Dupont speaks at IEEE CPMT 2010"},"content":{"rendered":"

This Wednesday, December 8th, the Finnish IEEE CPMT chapter is organizing an one day seminar<\/a> in Helsinki on „Current Topics on Board Level Reliability of Electronics“. Among other speakers Aubert Dupont, co-founder of xyztec, will speak. The emphasis will lay on the current and possible future methods for solder bond testing.<\/p>\n

<\/p>\n

Date:<\/b>\u00a0December the 8th, 2010
\nTime:<\/b>\u00a014:00 \u2013 17:40
\nPlace:<\/b>\u00a0Aalto University School of Science and Technology, Otakaari 7A, Seminar room 432.
\nProgram:<\/b><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n
14:00<\/td>\nOpening of the seminar<\/td>\n<\/tr>\n
14:01<\/td>\n\u201cThe Right Solder Paste for your Process\u201d – Emmanuelle Guene \u2013 Inventec Performance Chemicals<\/td>\n<\/tr>\n
14:25<\/td>\n\u201cSolder Paste Residue Corrosivity Assessments\u201d – Emmanuelle Guene \u2013 Inventec Performance Chemicals<\/td>\n<\/tr>\n
14:50<\/td>\n\u201cOptimization of the Surface Mount Process for Better Reliability\u201d – Jussi Hokka \u2013 Aalto University<\/td>\n<\/tr>\n
15:15<\/td>\n\u201cFormation of Microstructures in SnAgCu Solder Interconnections\u201d – Vesa Vuorinen \u2013 Aalto University<\/td>\n<\/tr>\n
15:40<\/td>\nCoffee break<\/td>\n<\/tr>\n
16:00<\/td>\n\u201cEffects of Alloying Elements on the IMC layers \u2013 Case of Cu and Ni\u201d – Vesa Vuorinen \u2013 Aalto University<\/td>\n<\/tr>\n
16:25<\/td>\n\u201cAn Overview of Failure Mechanisms under Different Loading Conditions\u201d – Toni Mattila \u2013 Aalto University<\/td>\n<\/tr>\n
16:50<\/td>\n\u201cAn introduction to Bond Testing\u201d – Aubert Dupont – XYZTEC<\/b><\/td>\n<\/tr>\n
17:15<\/td>\n\u201cCurrent and possible Future Methods for Solder Bond Testing\u201d – Aubert Dupont – XYZTEC<\/b><\/td>\n<\/tr>\n
17:40<\/td>\nClosing of the seminar<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

This Wednesday, December 8th, the Finnish IEEE CPMT chapter is organizing an one day seminar in Helsinki on „Current Topics on Board Level Reliability of Electronics“. Among other speakers Aubert […]<\/p>\n","protected":false},"author":7,"featured_media":18673,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[2957],"tags":[3808,3807,3809,3183,3810],"class_list":["post-10312","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","tag-aubert-dupont","tag-cpmt-2010","tag-event","tag-exhibition","tag-helsinki"],"acf":[],"yoast_head":"\nAubert Dupont speaks at IEEE CPMT 2010<\/title>\n<meta name=\"description\" content=\"The Finnish IEEE CPMT chapter is organizing an\u00a0one day seminar in Helsinki on "Current Topics on Board Level Reliability of Electronics".\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.xyztec.com\/de\/aubert-dupont-speaks-at-ieee-cpmt-2010\/\" \/>\n<meta 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