{"id":4850,"date":"2017-06-23T14:56:10","date_gmt":"2017-06-23T12:56:10","guid":{"rendered":"https:\/\/www.xyztec.com\/?p=4850"},"modified":"2017-06-23T14:56:10","modified_gmt":"2017-06-23T12:56:10","slug":"presentation-at-cspt-2017-by-bob-sykes","status":"publish","type":"post","link":"https:\/\/www.xyztec.com\/de\/presentation-at-cspt-2017-by-bob-sykes\/","title":{"rendered":"Presentation at CSPT 2017 by Bob Sykes"},"content":{"rendered":"<p>For the second year in a row, xyztec CTO Bob Sykes was invited to speak at China Semiconductor Packaging Test Symposium (CSPT).<\/p>\n<p><!--more--><\/p>\n<h2>Recent and Future Advances in Bond Testing<\/h2>\n<p>Hundreds of visitors attended the presentation on &#8222;Recent and Future Advances in Bond Testing&#8220;. The audience among which many leading corporations that employ bond testing was very interested in the subjects presented.<\/p>\n<p><img fetchpriority=\"high\" decoding=\"async\" class=\"alignnone size-full wp-image-19728\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/CSPT-2017-presentation-Bob-Sykes-hall-web.jpg\" alt=\"CSPT-2017-presentation-Bob-Sykes-hall-web\" width=\"618\" height=\"239\" \/><\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-19735\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/CSPT-2017-presentation-failure-mode-analysis-web.jpg\" alt=\"CSPT-2017-presentation-failure-mode-analysis-web\" width=\"618\" height=\"272\" \/><\/p>\n<p>&nbsp;<\/p>\n<h2>Presentation by Bob Sykes<\/h2>\n<p>Among the presented topics were the current state of technology in vision analysis and illumination, coating and film testing and xyztec&#8217;s brand new lead frame handler.<\/p>\n<p>&nbsp;<\/p>\n<h2>China Semiconductor Packaging Test Symposium (CSPT)<\/h2>\n<p>CSPT is a professional conference that focuses on Semiconductor Packaging &amp; Testing. It was held for the 15th time, this time in Jiangyin, China. Directed by Department of Electronics Information, the Ministry of Industry and Information Technology of the People\u2019s Republic of China and Chinese Institute of Electronics is organized by China Semiconductor Industry Association.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-19742\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/CSPT-2017-booth-XYZTEC-web.jpg\" alt=\"CSPT-2017-booth-XYZTEC-web\" width=\"618\" height=\"463\" \/><\/p>\n<p>&nbsp;<\/p>\n<h2>Bond testing seminar<\/h2>\n<p><a class=\"zwart\" href=\"https:\/\/www.xyztec.com\/about\/seminars\/\">Click here<\/a>\u00a0to\u00a0apply for a bond testing seminar.<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>For the second year in a row, xyztec CTO Bob Sykes was invited to speak at China Semiconductor Packaging Test Symposium (CSPT).<\/p>\n","protected":false},"author":7,"featured_media":17829,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[2957],"tags":[3232,3502,3499,3213,3498,3500,3261,3501],"class_list":["post-4850","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","tag-bob-sykes","tag-china-semiconductor-packaging-test-symposium","tag-coating","tag-cspt","tag-cspt-2017","tag-film-testing","tag-illumination","tag-lead-frame-handler"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Presentation at China Semiconductor Packaging Test Symposium by Bob Sykes<\/title>\n<meta name=\"description\" content=\"Topics were the state of technology in vision analysis and illumination, coating and film testing and xyztec&#039;s brand new lead frame handler.\" 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