Impact Measurement Unit
- High speed impact test
- Very large samples no problem
- Complete wafers possible
- Elevated sample temperature option
- Programmable impact energy and rate of strain
- Fatigue impact testing
Cost effective solution that can be fitted to a XYZTEC Condor Classic
Impact testing is an optional measurement unit (not a completely different machine) that can be installed on to a XYZTEC Condor Classic saving cost and space. The test is based on the long established Charpy pendulum method but with precision sensors that measure the test force on the shear tool and its position enabling accurate Force versus Displacement graphs of the test.
Because the tool moves not the test piece, large and heavy samples present no problem. Similarly heated sample chucks can be used to test the bond at elevated temperatures as may be the case in real life loading conditions. The pendulum design also allows test impact energy and rate of strain to be selected. These may be configured to cause the bond to fail on the first impact or after many impacts if the fatigue life is of more interest (see our page on impact testing).
| Specification | |
| Force measuring | 16 bits @ 5 MHz (max) |
| Position measuring | 23 bits @ 20 MHz (max) |
| Output metrics | Test force, test energy, test displacement, force versus displacement graph, velocity versus displacement graph |
| Maximum test speed | 4 m/s |
| Maximum sample size [WxDxH] | 500x250x150 (mm) |
| Maximum sample weight | 10 kg |
| Heated sample maximum temperature | 500 C |
Specifications subject to change without prior notice. Larger/heavier samples may be possible. Contact us for more information.
Contact us
Did we catch your attention? Please contact us for more information or to request a demonstration or a quotation.
Contributors
The development of the IMU was made possible by:
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Relevant applications
Special applications
Please contact us if you have any special tweezer requirements.
Download article
Click here to download the article "Alternative Testing Methods for Electronic Assemblies" (PDF) by Mathias Nowottnick and Andrej Novikov from the University of Rostock and Dirk Schade and Bob Sykes from XYZTEC.
Download article
Click here to download the article "Effect of Temperature on Transition in Failure Modes for High Speed Impact Test of Solder Joint and Comparison with Board Level Drop Test" (PDF) by Pradosh Guruprasad and James Pitarresi, Binghamton University, USA and Bob Sykes, Chief Technical Officer for XYZTEC.
Download article
Click here to download the article "Effect of Temperature on Transition in Failure Modes for High Speed Impact Test of Solder Joint and Comparison with Board Level Drop Test" (PDF) by Pradosh Guruprasad and James Pitarresi, Binghamton University, USA and Bob Sykes, Chief Technical Officer for XYZTEC.
Presentation
Click here to download the article "Alternative Testing Methods for Electronic Assemblies" (PDF) by Mathias Nowottnick and Andrej Novikov from the University of Rostock and Dirk Schade and Bob Sykes from XYZTEC.
Relevant test types
A wide variety of test types are relevant for this industry, among which are:
Pull tests |
Bending test |
Special applications
Please contact us if you have any special tweezer requirements.