The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the tool and cameras in record speed. The 30nm resolution linear encoders ensure accurate positioning.
The Condor Sigma automation features ensure rapid testing of randomly selected positions on the wafer. Fiducial mark recognition can guarantee a high repeatability. Cameras also assist the operator to perform grading. The grading run functionality enables quick grading after a sequence of tests.
The Condor Sigma W12 can be equipped with up to two perpendicular cameras and a camera mounted on a trinocular microscope. We recommend using a low and a high magnification camera for best positioning and grading. A second monitor can show (live) camera images for ease of operation.
To prepare for wafer probing, big bumps need to be removed by shearing them off and cleaning any debris. Fully programmable vision algorithms are used to check if big bumps are successfully removed.
Compatibility with the XYZTEC Revolving Measurement Unit (RMU) ensures that you can switch between test types and tools with the press of a button. Unused sensors (cartridges) are protected within the machine. The RMU can hold up to 6 sensors in any combination, including up to 4 USB Tweezers.
The XY mapping function enables the operator to quickly and accurately move from position to position on the wafer by keying in a relative move. Naturally, the Condor Sigma W12 is equipped with 30nm resolution linear encoders, ensuring 0,5µm repeatability.
The Condor Sigma W12 can be integrated with various types of wafer handlers (Equipment Front End Module, EFEM). Integration transforms the bond tester into a fully automated system.
We offer leading edge products for up to 300 mm equipment frontend module platforms.
Among our customers are the world’s top 4 semiconductor packaging houses, which require high precision, fully automated, low vibration, maximum throughput, warped wafer testing and extensive safety features.
The Condor Sigma W12 features automatic wafer size detection, PID controlled centered lift pins for with guaranteed secure wafer loading and un-loading.
Please contact us for more information and your specific wishes. We have experience with various wafer handler suppliers.
Among other protocols, XYZTEC offers SECS/GEM communication directly in the Condor Sigma software or via an EFEM. Contact XYZTEC for more information and options for your factory.
Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.
To find your local representative, please select a region: