How to test bonds

By this section of our website we aim to spread knowledge about bond testing in the industry. We currently offer how-to's on Cold Bump Pull (CBP), Wire Pull (WP) and Tweezer Pull (TP) and we intend to expand it into other test types as well in the future. Additionally, you can find here the text of the relevant MIL-STD-883 standards in accessible HTML format. Please feel free to use these guides to bond testing and we invite you to let us know if you have any comments or specific questions regarding the application of it to your samples, whether you use our equipment or not.



© 1999-2016 XYZTEC BV Disclaimer, Privacy, Cookies
Home
News
Condor Sigma
Condor 150HF
Test types
Markets & solutions
Sales & support
Downloads
Events
Shop

XYZTEC Netherlands

J.F. Kennedylaan 14-B
5981 XC Panningen
Netherlands (map / route)

Tel: +31-77-3060920
Fax: +31-77-3060919

Find your local representative

XYZTEC Germany

Schäferei 18
06237 Leuna
OT Günthersdorf
Germany
(map / route)
Tel: +49-34638-666690
Fax: +49-34638-666695
Cell: +49-172-3272991
Email: Dirk Schade

Find other office locations

Technology leader in bond testing worldwide