How to test bonds

By this section of our website we aim to spread knowledge about bond testing in the industry. We currently offer how-to's on Cold Bump Pull (CBP), Wire Pull (WP) and Tweezer Pull (TP) and we intend to expand it into other test types as well in the future. Additionally, you can find here the text of the relevant MIL-STD-883 standards in accessible HTML format. Please feel free to use these guides to bond testing and we invite you to let us know if you have any comments or specific questions regarding the application of it to your samples, whether you use our equipment or not.

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