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The construction of solder balls varies a lot. Variables include;
There are also many different bump alloys, pad alloys, pad surface finishes, reflow processes and aging.
Because of this variety there are no industrial standards for bond strength.
As a general guide based on ductile failure and the strength of solder the maximum test force will be in the region shown in this graph.
The cavities of the jaws will become contaminated by debris from the bump. To maintain good and consistent testing this must be cleaned away.
It can be done manually, but be very careful not to damage the jaws and their cavities. Solder can be automatically cleaned off using XYZTEC’s patented contactless cleaning system (click here to view a video). Contact your local representative for details.
The following five failure mode definitions, that can be further divided into eight types, have been set by JEDEC. In this how-to we already mentioned most of them. We refer to the JEDEC website for full details.
The determination of failure modes is also called grading. As vision technology progresses, it is expected that machines will be able to grade failure modes even more effectively than humans.
With its advanced Halcon vision library and high resolution perpendicular cameras with smart lighting systems, several customers already use the Condor Sigma to accurately determine failure modes in solder bumps.
Click here for more information about the Condor Sigma bond tester and its unique properties.