How to test bonds » Lead integrity » MIL-STD-883 method 2004.7 lead integrity

Page 2/9: Test condition A - Tension

  1. PURPOSE

    This test is designed to check the capabilities of the device leads, welds, and seals to withstand a straight pull.

  2. APPARATUS

    The tension test requires suitable clamps and fixtures for securing the device and attaching the specified weight without lead restriction. Equivalent linear pull test equipment may be used.

  3. PROCEDURE

    A tension of 0.227 kg (8 ounces), unless otherwise specified, shall be applied, without shock, to each lead or terminal to be tested in a direction parallel to the axis of the lead or terminal and maintained for 30 seconds minimum. The tension shall be applied as close to the end of the lead (terminal) as practicable.

    1. Failure criteria

      When examined using magnification between 10X and 20X after removal of stress, any complete breakage (e.g. separation of the lead from the body) or loosening of the lead at the glass/ceramic seal that has caused a method 1014 seal failure shall be considered a failure. When a seal test in accordance with method 1014 is conducted as a post test measurement following the lead integrity test(s), meniscus cracks shall not be cause for rejection of devices which pass the seal test.

  4. SUMMARY

    The following details shall be specified in the applicable acquisition document:

    1. Weight to be attached to lead, if other than .227 kg (8 ounces) (see 3).

    2. Length of time weight is to be attached, if other than 30 seconds (see 3).

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How to test bonds?

Lead integrity

All XYZTEC bond testers can be used for lead integrity testing. The MIL standard on this page describes the procedure in technical language. Our lead integrity test type page illustrates the test conditions A, B1, B2, C1, C2 and D with real examples. Click here to go there.

MIL-STD-883 method 2004.7 consists of 9 pages:

  1. Lead integrity
  2. A - Tension
  3. A1 - Lead braze integrity
  4. B1 - Bending stress
  5. B2 - Lead fatigue
  6. C1 - Lead torque
  7. C2 - Stud torque
  8. D - Solder pad adhesion for leadless chip carrier and similar devices
  9. E - Lead plating integrity

Lid torque for glass-frit-sealed packages

For lid torque testing, MIL-STD 883 Method 2024.2 applies. Click here to go there.

We have converted the method into a readable HTML format, just like MIL-STD-883 method 2004.7 here.

Die shear

Die shear on LTCC
Die shear on LTCC

Die shear strength is the subject of MIL-STD-883 Method 2019.9. We also have a page on the test type, laying out the unique characteristics of XYZTEC's bond testers in relation to die shear.

Stud pull

The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested. For flip-chip pull-off tests MIL-STD-883 method 2031.1 applies.

Wire Pull

www.wirepull.how

Click here if you wish to learn everything there is to know about Wire Pull. The extensive how-to on Wire Pull consists of 12 paragraphs, 7 pages and 4 appendices.

Cold Bump Pull

www.coldbumppull.how

Click here if you wish to learn everything there is to know about Cold Bump Pull (CBP). The extensive how-to on CBP consists of 12 paragraphs and 7 pages.


Test types

How to test bonds?

Lead integrity

All XYZTEC bond testers can be used for lead integrity testing. The MIL standard on this page describes the procedure in technical language. Our lead integrity test type page illustrates the test conditions A, B1, B2, C1, C2 and D with real examples. Click here to go there.

MIL-STD-883 method 2004.7 consists of 9 pages:

  1. Lead integrity
  2. A - Tension
  3. A1 - Lead braze integrity
  4. B1 - Bending stress
  5. B2 - Lead fatigue
  6. C1 - Lead torque
  7. C2 - Stud torque
  8. D - Solder pad adhesion for leadless chip carrier and similar devices
  9. E - Lead plating integrity

Lid torque for glass-frit-sealed packages

For lid torque testing, MIL-STD 883 Method 2024.2 applies. Click here to go there.

We have converted the method into a readable HTML format, just like MIL-STD-883 method 2004.7 here.

Die shear

Die shear on LTCC
Die shear on LTCC

Die shear strength is the subject of MIL-STD-883 Method 2019.9. We also have a page on the test type, laying out the unique characteristics of XYZTEC's bond testers in relation to die shear.

Stud pull

The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested. For flip-chip pull-off tests MIL-STD-883 method 2031.1 applies.

Wire Pull

www.wirepull.how

Click here if you wish to learn everything there is to know about Wire Pull. The extensive how-to on Wire Pull consists of 12 paragraphs, 7 pages and 4 appendices.

Cold Bump Pull

www.coldbumppull.how

Click here if you wish to learn everything there is to know about Cold Bump Pull (CBP). The extensive how-to on CBP consists of 12 paragraphs and 7 pages.


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