How to test bonds » Lead integrity » MIL-STD-883 method 2004.7 lead integrity

Page 6/9: Test condition C1 - Lead torque

  1. PURPOSE

    This test is designed to check device leads (or terminals) and seals for their resistance to twisting motions.

  2. APPARATUS

    The torque test requires suitable clamps and fixtures, and a torsion wrench or other suitable method of applying the specified torque without lead restriction.

  3. PROCEDURE

    The appropriate procedure of 3.1 or 3.2 for the device under test shall be used.

    1. Procedure for devices with circular cross-section terminals or leads

      The device body shall be rigidly held and the specified torque shall be applied for 15 seconds minimum to the lead (terminal) to be tested, without shock, about the axis of the lead (terminal).

    2. Procedure for devices with rectangular cross-section terminals or leads

      The device body shall be rigidly held and a torque of 1.45 ±.145 kg-mm (2.0 ±0.2 ounce-inch) unless otherwise specified, shall be applied to the lead (terminal) at a distance of 3.05 ±0.76 mm (0.12 ±0.03 inch) from the device body or at the end of the lead if it is shorter than 3.05 mm (0.12 inch). The torque shall be applied about the axis of the lead once in each direction (clockwise and counterclockwise). When devices have leads which are formed close to the body, the torque may be applied 3.05 ±0.76 mm (0.12 ±0.03 inch) from the form. For device leads which twist noticeably when less than the specified torque is applied, the twist shall be continued until the twist angle reaches 30° ±10° or the specified torque is achieved, whichever condition occurs first. The lead shall then be restored to its original position.

    3. Failure criteria

      When examined using magnification between 10X and 20X after removal of the stress, any complete breakage (e.g. separation of the lead from the body) or loosening of the lead at the glass/ceramic seal that has caused a method 1014 seal failure shall be considered a device failure. When a seal test in accordance with method 1014 is conducted as a post test measurement following the lead integrity test(s), meniscus cracks shall not be cause for rejection of devices which pass the seal test.

  4. SUMMARY

    The following details shall be specified in the applicable acquisition document:

    1. Torque to be applied for circular cross-section leads (see 3.1).

    2. Duration of torque application for circular cross-section leads, if other than 15 seconds minimum (see 3.1).

    3. Torque to be applied for rectangular cross-section leads, if other than 1.45 ±0.145 kg-mm (2.0 ±0.2 ounce-inch) (see 3.2).

    4. See general summary above.

    5. Post test measurements, if applicable (see 3.3).

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How to test bonds?

Lead integrity

All XYZTEC bond testers can be used for lead integrity testing. The MIL standard on this page describes the procedure in technical language. Our lead integrity test type page illustrates the test conditions A, B1, B2, C1, C2 and D with real examples. Click here to go there.

MIL-STD-883 method 2004.7 consists of 9 pages:

  1. Lead integrity
  2. A - Tension
  3. A1 - Lead braze integrity
  4. B1 - Bending stress
  5. B2 - Lead fatigue
  6. C1 - Lead torque
  7. C2 - Stud torque
  8. D - Solder pad adhesion for leadless chip carrier and similar devices
  9. E - Lead plating integrity

Lid torque for glass-frit-sealed packages

For lid torque testing, MIL-STD 883 Method 2024.2 applies. Click here to go there.

We have converted the method into a readable HTML format, just like MIL-STD-883 method 2004.7 here.

Die shear

Die shear on LTCC
Die shear on LTCC

Die shear strength is the subject of MIL-STD-883 Method 2019.9. We also have a page on the test type, laying out the unique characteristics of XYZTEC's bond testers in relation to die shear.

Stud pull

The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested. For flip-chip pull-off tests MIL-STD-883 method 2031.1 applies.

Wire Pull

www.wirepull.how

Click here if you wish to learn everything there is to know about Wire Pull. The extensive how-to on Wire Pull consists of 12 paragraphs, 7 pages and 4 appendices.

Cold Bump Pull

www.coldbumppull.how

Click here if you wish to learn everything there is to know about Cold Bump Pull (CBP). The extensive how-to on CBP consists of 12 paragraphs and 7 pages.


Test types

How to test bonds?

Lead integrity

All XYZTEC bond testers can be used for lead integrity testing. The MIL standard on this page describes the procedure in technical language. Our lead integrity test type page illustrates the test conditions A, B1, B2, C1, C2 and D with real examples. Click here to go there.

MIL-STD-883 method 2004.7 consists of 9 pages:

  1. Lead integrity
  2. A - Tension
  3. A1 - Lead braze integrity
  4. B1 - Bending stress
  5. B2 - Lead fatigue
  6. C1 - Lead torque
  7. C2 - Stud torque
  8. D - Solder pad adhesion for leadless chip carrier and similar devices
  9. E - Lead plating integrity

Lid torque for glass-frit-sealed packages

For lid torque testing, MIL-STD 883 Method 2024.2 applies. Click here to go there.

We have converted the method into a readable HTML format, just like MIL-STD-883 method 2004.7 here.

Die shear

Die shear on LTCC
Die shear on LTCC

Die shear strength is the subject of MIL-STD-883 Method 2019.9. We also have a page on the test type, laying out the unique characteristics of XYZTEC's bond testers in relation to die shear.

Stud pull

The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested. For flip-chip pull-off tests MIL-STD-883 method 2031.1 applies.

Wire Pull

www.wirepull.how

Click here if you wish to learn everything there is to know about Wire Pull. The extensive how-to on Wire Pull consists of 12 paragraphs, 7 pages and 4 appendices.

Cold Bump Pull

www.coldbumppull.how

Click here if you wish to learn everything there is to know about Cold Bump Pull (CBP). The extensive how-to on CBP consists of 12 paragraphs and 7 pages.


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