This extensive how-to consists of 9 paragraphs and 6 pages. Please use the navigation on the right.
This manual is a guide advising what to consider and how to best perform a Tweezer Pull test. Also described is tweezer peel testing. More on Cold Bump Pull testing, a type of Tweezer testing on solder balls or bumps, can be found in a separate how-to.
Tweezer pull and peel tests are normally not difficult to do, if you own the right equipment. This how-to covers a variety of subjects. Follow it to obtain consistent results and the highest degree of quality assurance.
Tweezer pull is simply a pull test performed by a tweezer. During the test an upward force is applied to a wire, a ribbon or some other feature on your sample after being gripped by the tweezers. In many cases, the sample has to be prepared for testing first.
A peel test is essentially the same, but apart from an upward movement, the XY stage also does a controlled move. Normally, the purpose is to maintain a perpendicular force on the ribbon or wire being pulled off the substrate.