Technical Informer: USB Tweezers

1 July 2010


Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. Examples include solder ball pull (often referred to as CBP) and ribbon peel. The sizes of parts range from a few millimetres to tens of microns and the bond strength from several kilograms to one or two grams force. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient force can be applied to the bond but without the act of griping affecting the bond itself. To cater for this XYZTEC developed a new generation of tweezer with both a precise gripping action and the flexibility to suit a wide range of applications.

Features of the XYZTEC USB Tweezers

The gripping jaws (Tweezers or tips) are driven by a built‐in 3‐phase brushless micro drive to accurately open or close and the jaw actuators incorporate a strain gauge to precisely measure and control the grip force. There is a choice of two types of motor, standard force or high force, refer to the specification for the performance details. The combination of positional and force control provides programmable control of all the gripping functions.

  • The gripping force is known from the inbuilt calibrated force sensor. A grip force can be programmed and is then maintained throughout the test via force control loop software.
  • Similarly the position of the jaws is known and controlled via the actuating micro motor. This enables programmable control of the closing and opening positions.
  • In the same way the closing and opening speed can also be programmed. Closing speed can be very important in some applications. Closing too fast can cause cracks to form in the bond due to the gripping action which are avoidable if the jaws close slowly.
  • The tweezers are fitted to a standard pull sensor which provides the pull force data for the test. This sensor can also be used to sense when the tips of the jaws touch the sample and can also be used to land with a programmable force.
  • Once contact with the sample has been detected. There is an option to raise the jaws to a programmable height above the contact position prior to closing the jaws to grip the sample.
  • There are a standard range of jaws to suit many different applications, for example Gold wire pull or Aluminium ribbon peel. Custom designs for less common or new applications are also possible.
  • The jaws themselves are Quick Release and can be changed in a matter of seconds. This is invaluable when a number of applications require different jaws designs.
  • The Tweezer come complete with an integral illumination system of high intensity L.E.D.'s.
  • The power and control of the tweezers is supplied by one USB connection to the machine computer.
  • The USB tweezers is a stand‐alone device and can be used with any PC.


SpecificationStandard forceHigh force
Max. closing force1.5 kgf2.5 kgf
Max. jaw opening0.8 mm0.8 mm
Pull force*1.0 to 1.5 kgf5 to 6 kgf
Min. closing time3.5 s17.5 s

See also our webpage on the USB Tweezers.

Click here to download the complete "USB Tweezers Technical Informer" (PDF) by XYZTEC.


Dec 2019 Xyztec faces any challenge
Jul 2019 Meet the world’s biggest bond testers
Apr 2019 Free SMTconnect ticket? Register now
Aug 2018 Is Fully Automatic Bond Testing Possible?
Jul 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
May 2017 Shear testing copper pillar
Mar 2017 Fracture strength of thin wafers and die
Feb 2017 Centralized database for enhanced security and SPC options
Jan 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
Dec 2016 Coating and film testing
Nov 2016 Latest software release enables automatic grading
Oct 2016 Vision enhanced materials testing

Click to subscribe.

Other news

24 Sep Meet us at the Semicon Taiwan
02 Mar EPIC invests in XYZTEC’s most advanced bond tester
17 Jan Visit us in Tokyo this month
13 Nov Visit us at Productronica in München
03 Oct Xyztec at EuWoRel Berlin
18 Sep Sigma and Magazine Loader in action at Semicon Taiwan
17 Sep Xyztec at EMPC conference in Pisa
04 Sep Meet us worldwide in September
05 Jul Teaming up with Micronnect B.V. and BRIDGE S.r.l.
07 May Newest Sigma HF High Force bond tester live in action at SMTconnect
26 Apr XYZTEC spreads bond testing knowledge to partners worldwide
20 Mar Visit us at Semicon China
29 Jan XYZTEC at Semicon Korea
21 Nov Presentation at CSPT 2018
15 Nov Matelec show 2018 for the Electrical and Electronics Industry with Antycip
20 Sep Successful ESTC Conference in Dresden, Germany
11 Jul LEGO® for Nepal sponsored by XYZTEC
05 Jun Visit us at SMT Hybrid Packaging Nuremberg
20 Apr Smart LED and Solar panels for XYZTEC head office
18 Apr XYZTEC workshop at IMAPS UK
16 Mar ODEOM shows Condor Sigma in Istanbul
15 Mar Semicon China under way
31 Jan Condor Sigma W12 at Semicon Korea
04 Dec Condor Sigma stars in Audi Tech Day video
10 Nov Raysun to represent XYZTEC in China

View all news

Subscribe to our RSS-feed to be notified of the latest news automatically. You can also find us on Facebook, LinkedIn, Twitter, Weibo 微博, Google+, YouKu 优酷 and YouTube.

XYZTEC Newsletter


Your name:

Your email:

© 1999-2016 XYZTEC BV Disclaimer, Privacy, Cookies
Condor Sigma
Condor 150HF
Test types
Markets & solutions
Sales & support

XYZTEC Netherlands

J.F. Kennedylaan 14-B
5981 XC Panningen
Netherlands (map / route)

Tel: +31-77-3060920
Fax: +31-77-3060919

Find your local representative

XYZTEC Germany

Schäferei 18
06237 Leuna
OT Günthersdorf
(map / route)
Tel: +49-34638-666690
Fax: +49-34638-666695
Cell: +49-152-21722629
Email: Volker Loibl

Find other office locations

XYZTEC New Hampshire

33 South Main Street Unit #1,
Wolfeboro, NH 03894
(map / route)
Tel: +1-978-880-2598

Find other office locations

Technology leader in bond testing worldwide