Presentation at CSPT 2018

21 November 2018

Cor van Mil delivers speech about “What is Sigma” and automatic bond testing at CSPT 2018Cor van Mil delivers speech about “What is Sigma” and automatic bond testing at CSPT 2018

Also this year, XYZTEC was a participant at the yearly China Semiconductor Packaging and Test Technology & Market Conference 2018 to present the latest developments in automatic bond testing.

Hundreds of visitors attended the presentation on "What is Sigma" about what is needed for automatic bond testing and how to perform a perfect shear and pull test. With the most advanced bond tester, the Condor Sigma, fully automatic bond testing is possible. XYZTEC offers the full package for automatic bond testing consisting of automatic loading, testing and analysis.

Cor van Mil presenting at CSPT 2018: What is needed for automatic bond testing?Cor van Mil presenting at CSPT 2018: What is needed for automatic bond testing?

China Semiconductor Packaging and Test Technology & Market Annual Conference is the only authoritative and most widely recognized professional seminar covering the entire semiconductor packaging and testing industry in China. The 16th annual conference was successfully held in Hefei China on November 19 till 22. The conference was about "integrated innovation, intelligent production, integration and sharing".

Presentation at CSPT 2018 in Hefei China about automatic bond testing in front of hundreds interest visitors.Presentation at CSPT 2018 in Hefei China about automatic bond testing in front of hundreds interest visitors.

The audience among which many government leaders and leading corporations that employ bond testing were very interested about the automation possibilities for bond testers and the other subjects presented.

XYZTEC, your partner in backend automation.

XYZTEC booth at CSPT 2018XYZTEC booth at CSPT 2018

Newsletters

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