11 March 2015
Did you know you can use the Condor Sigma for measuring the wire loop height on your samples? XYZTEC bond testers have been doing loop height tests for years, but the technology goes forward and testing becomes more advanced and accurate. Read on to find out more about loop height testing with the Condor Sigma.
Bond testers are traditionally used for force measurement only, but the extreme positional accuracy of the Condor Sigma platform also enables you to measure whether the dimensions of your product are within specification, with never before seen accuracies. The system is equipped with 30nm resolution linear encoders and is completely backlash free (no gear box).
On any Condor Sigma bond tester, the loop height measurement test method is available for free using pull sensors. The system will accurately determine the height of a wire, ribbon or other component above the surface. The measurement result in this case is not a force, but a distance.
To enable quicker testing, the system can store the Z-height of the surface under the first wire and use this value again when sensing the following multiple wires. It is also possible to probe the surface height in a different spot than directly under the wire.
The operator can combine loop height measurement with a pull test, whether destructive or not. In that case, the loop height distance is simply presented alongside the force measurement result.
As with regular wire pull, it is possible to use the hook shift functionality of the Condor Sigma to position a fine pitch hook accurately under the wire in tight spaces. Auto hook is also available and the loop height measurement test method is of course for both manual and automatic testing.
The Condor Sigma is also unique because of its programmable landing force down to 2,5 gf. Combined with an also programmable probe test speed, this enables very delicate sensing. Deformations or damage to the sample are therefore minimized.
Did we catch your attention? Please contact us for more information, to request a demonstration or a quotation.
|Jul 2019||Meet the world’s biggest bond testers|
|Apr 2019||Free SMTconnect ticket? Register now|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|05 Jul||Teaming up with Micronnect B.V. and BRIDGE S.r.l.|
|07 May||Newest Sigma HF High Force bond tester live in action at SMTconnect|
|26 Apr||XYZTEC spreads bond testing knowledge to partners worldwide|
|20 Mar||Visit us at Semicon China|
|29 Jan||XYZTEC at Semicon Korea|
|21 Nov||Presentation at CSPT 2018|
|15 Nov||Matelec show 2018 for the Electrical and Electronics Industry with Antycip|
|20 Sep||Successful ESTC Conference in Dresden, Germany|
|11 Jul||LEGO® for Nepal sponsored by XYZTEC|
|05 Jun||Visit us at SMT Hybrid Packaging Nuremberg|
|20 Apr||Smart LED and Solar panels for XYZTEC head office|
|18 Apr||XYZTEC workshop at IMAPS UK|
|16 Mar||ODEOM shows Condor Sigma in Istanbul|
|15 Mar||Semicon China under way|
|31 Jan||Condor Sigma W12 at Semicon Korea|
|04 Dec||Condor Sigma stars in Audi Tech Day video|
|10 Nov||Raysun to represent XYZTEC in China|
|23 Oct||Award for First Technology China|
|19 Jul||XYZTEC granted subsidy for further accuracy improvements|
|23 Jun||Presentation at CSPT 2017 by Bob Sykes|
|06 Jun||Condor Sigma in São Paulo, Brazil|
|16 May||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|
|28 Apr||Semicon Penang 2017 successful|
|28 Apr||Pizza and Go cart racing at K1 Speed in Northern CA|
|14 Mar||Visit us at Semicon China|