5 September 2014
The Condor Sigma W12 is based on XYZTEC’s market leading Condor Sigma platform. It shares many of the same features that set the Condor Sigma apart from the rest of the industry. The W12’s performance has been further enhanced for the precision and handling requirements of wafer testing.
The W12 is designed to test any wafer size up to 300mm. Switching from various wafer sizes is a simple procedure. The goal was to minimize downtime for companies that have multiple wafer diameters. Many test types are possible on the Sigma W12. The most common include solder ball shear and Cold Bump Pull (CBP) testing. XYZTEC’s latest development is Pull Testing solder bumps on copper pillars. XYZTEC also offers solutions for wire bonds on wafer. With the widest range of sensors and tooling there is something to suit almost any bond test application.
All of XYZTEC’s axis movements are controlled with linear encoders. This technology provides unrivalled accuracy and it offers a significant improvement compared with rotary encoder solutions found on other equipment.
Whether you are using the system in the manual or automatic mode, intelligent axis speed control of up to 50mm/s enables the fastest traverse time over long distances. However, the W12 employs an automatic slow down feature as the tool approaches the target. This feature ensures precision and safety. Set up time is minimal. Wafer-map import capability provides accurate and rapid data transfer of the bonds to be tested. Other production functions include; onboard barcode reading and SPC data down load.
The Sigma W12 offers stand-alone manual loading or it can be fully integrated with wafer handlers (loader/unloader). With the optional rotary table feature, wafer orientation can be accomplished quickly and accurately using manual or automatic functionality. A range of vacuum chucks and pin transfer options enable the handling of the most challenging of wafers.
A range of onboard camera options enable high magnification images of the failure mode. These can be saved along with the test data either automatically or under operator control.
A debris collection option manages the debris resulting from test. Options include a programmable timed-pulse from an air jet to dislodge loose material from the test area, as well as a material vacuum pickup that captures loose material in a collection filter.
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|Jun 2015||Increase your bondtesting throughput|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.