30 September 2016
In this newsletter we describe a new method of testing the seal and adhesive quality of lid encapsulated devices.
Typically this test is done by stud pull and gluing the lid and base of the device to two blocks of metal with screw holes in them that are used to apply the pull load. The disadvantages of this include;
The new XYZTEC mechanical grip method consists of reusable parts that are accurately aligned the test load to the device. They can be quick release and in many cases handle a range of similar devices.
The lid and base of the device are gripped along their edges by side clamps.
The grippers can be screw fixed as is this example or quick release with a single lever operation. When the gap between the lid and its base is very small some sample preparation will probably be required. In such cases a bench mounted preparation jig can be provided.
The bond can also easily be tested at elevated temperature by mounting either the lid clamp or base clamp onto a heated platform. See our extensive range of work holders.
If you are interested in a live demonstration of the Condor Sigma on your sample or perhaps for more bond testing inspiration, contact us today! If you like our newsletter, feel free to share it with a friend or colleague.
XYZTEC manufactures and supports a complete range of bond test equipment for the printed circuit board assembly, semiconductor and other industries. The company was founded in 2000 and has seven direct offices around the world, with headquarters in Panningen, The Netherlands.
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|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.