22 December 2016
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Condor Sigma shear sensors include a vertical force sensor that provide its unique programmable landing force feature. For scratch testing this enables the scratch force to be controlled and synchroniously measured together with the horizontal shear force. This provides the control needed for scratch testing including the 3 standard procedures;
As with any scratch tester the quality of the bond between layers can be seen in the failure mode and force displacement graph. The following examples show the same PLST on multi layer films of different constructions.
Additional failure mode analysis such as EDX helps to show at what point layers fail. With this deeper understanding quality assurance may subsequently only require scratch testing.
The Condor Sigma is a highly flexible micro materials tester specifically designed for the semiconductor and electronics industry. From its very beginning it was designed for easy and comfortable manual use, making it much faster than any dedicated scratch tester.
Its fully automatic mode delivers even more benefit. Samples are simply loaded and tested. The Sigma has fiducial mark pattern recognition to locate the samples position and then tests with precision with whatever combination of scratch tests you want. These can be different positions, procedures, directions and speeds. Being automatic, every sample is tested in exactly the same way. In a recent application, a product that required 1 day to test takes a mere 2 minutes on the Condor Sigma!
We at XYZTEC had a great 2016 and sold more bond testers than ever before, achieving market leadership! We are also looking forward to the New Year and will continue to innovate. Why not make 2017 the year you saw the benefits of a new XYZTEC Condor Sigma!
Choosing the Condor Sigma is a future proof choice, as all systems come with lifetime free software upgrades. Maybe we can interest you in a live demonstration of the Condor Sigma on your sample? For more bond testing inspiration in 2017, contact us today!
We wish all of our newsletter readers the very best for the new year.
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|Jun 2015||Increase your bondtesting throughput|
|May 2015||USB Tweezers|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.