31 January 2017
XYZTEC release a range of 6.4M pixel vertical view camera systems with the addition of Coaxial (Light Field) and improved Diffused (Dark Field) illumination. These new systems increase automation capability and complement our existing high magnification image capture.
The all new systems come with magnifications of 5X, 3X or Wide View (corresponding fields of view 1.5x1mm, 2.7x1.8mm and 15x11mm). This range covers high magnification test failure mode analysis and image capture through to fiducial mark analysis and wire detect enabling full automatic testing even when the position of the wires varies between sample batches.
One, two or three vertical view camera systems can be mounted on a Sigma bond tester enabling the full range of magnifications. The systems are rigidly mounted with no moving parts (like mechanical zooms) to ensure the highest image positional accuracy. The new 6.4M Pixel camera chip and precision optics ensure the spatial resolution required for every application even when using digital zoom.
In this dark field example many wires are clearly made visible for easy camera programming of wire and bond positions. If the position of wires varies between samples our wire detect option automatically makes the required correction for each test.
Failure mode analysis is easy with our image capture options. This example of 250µm solder ball zone shear (total ball shear) at 50mm/s shows how 6 different failure modes are clearly visible.
As the market leader in bond testing, XYZTEC has produced many success stories over the years. Since our founding in 2000, we are dedicated to one thing and one thing only…..BOND TEST SOLUTIONS! We continue to develop solutions for all types of industries including solar, space, military, medical, automotive, interconnect and material science. Our customers include market leaders in all of these industries throughout the world. See why many people refer to our Condor Sigma as the Swiss army knife of bond testers If you are interested in a live demonstration of the Condor Sigma on your sample or perhaps for more bond testing inspiration, contact us today!
References are available and happily provided.
|Dec 2018||The Science of Bond Testing|
|Aug 2018||Is Fully Automatic Bond Testing Possible?|
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.