Newsletter: Copper pillar testing

18 December 2014

Copper pillar
Copper pillar

Copper pillar testing

Copper Pillar is rapidly being adopted as a bumped wafer interconnect. The construction is that of a Copper cylinder around 50µm in diameter and height, topped with a dome of solder.

Pull test copper pillar gripped with two tapered cavities
Pull test copper pillar gripped with two tapered cavities

As with any interconnect the quality of the bonding process between the different parts is vital for the reliability of the finished product. The bond between the copper and its pad on the wafer are of particular interest as this is seen as the most likely failure mode. In a bond test a failure mode between the copper and wafer is then the “Failure mode of interest”. This failure mode can be produced by either a pull or a shear test and the measured bond strength used for process control.

Copper pillar shear test
Copper pillar shear test

The choice between pull or shear testing depends on the application and the test objectives. If you are interested to find out more please contact us for more information, to request a demonstration or a quotation.

More details

Click here to read the full technical informer about copper pillar testing.

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