27 May 2015
As the world is choosing to migrate to XYZTEC bondtesters, the most heard argument is that companies wish to be future proof. In a competitive environment, opting for old technology is taking a risk that smart managers steer clear off. XYZTEC's USB Tweezers are just another example of the Condor Sigma outperforming the competition.
XYZTEC's USB Tweezers are a unique electrically actuated micro grippers solution designed especially for solder ball pull, thick wire pull, thin wire pull and ribbon peel testing. The features include a powerful software, fully programmable closing force and positioning, a built-in adjustable light source and easily exchangeable tips.
Using USB Tweezers, you can precisely control and document the settings of your tweezer test. Both when testing automatically and when testing manually, this makes your process more precise and fully traceable. XYZTEC also leads the way when it comes to tweezer tip design. Multiple customers use USB Tweezers for exotic applications and we produce standard cold bump pull cavities down to 50µm ball size.
During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily. Click here to find out more information about XYZTEC's patented solution: the CBP Jaw Cleaner.
|Jul 2017||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|May 2017||Shear testing copper pillar|
|Mar 2017||Fracture strength of thin wafers and die|
|Feb 2017||Centralized database for enhanced security and SPC options|
|Jan 2017||Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis|
|Dec 2016||Coating and film testing|
|Nov 2016||Latest software release enables automatic grading|
|Oct 2016||Vision enhanced materials testing|
|Sep 2016||XYZTEC makes lid pull easy|
|Aug 2016||Condor Sigma W12 with large heater stage|
|Jul 2016||How to: Wire Pull|
|Jun 2016||Get 10% off your next tools order|
|May 2016||Pull testing bumped wafers|
|Apr 2016||SMD gull wing leads testing|
|Mar 2016||Automation: matrix bond testing made easy|
|Feb 2016||Fully integrated solution for automated wafer testing|
|Jan 2016||In bond testing, size does matter|
|Dec 2015||XYZTEC goes from strength to strength|
|Nov 2015||Automatic wire detect|
|Oct 2015||Highly reproducible stud pull tests are possible|
|Sep 2015||What is the quality of your coatings?|
|Aug 2015||Loading samples has never been so easy|
|Jul 2015||Axis accuracy of ±1µm: essential for automatic bond testing|
|Jun 2015||Increase your bondtesting throughput|
|May 2015||USB Tweezers|
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.