Newsletter: USB Tweezers

27 May 2015

USB Tweezers: another reason why the world is switching to the Condor Sigma

As the world is choosing to migrate to XYZTEC bondtesters, the most heard argument is that companies wish to be future proof. In a competitive environment, opting for old technology is taking a risk that smart managers steer clear off. XYZTEC's USB Tweezers are just another example of the Condor Sigma outperforming the competition.

USB Tweezers

XYZTEC's USB Tweezers are a unique electrically actuated micro grippers solution designed especially for solder ball pull, thick wire pull, thin wire pull and ribbon peel testing. The features include a powerful software, fully programmable closing force and positioning, a built-in adjustable light source and easily exchangeable tips.

Using USB Tweezers, you can precisely control and document the settings of your tweezer test. Both when testing automatically and when testing manually, this makes your process more precise and fully traceable. XYZTEC also leads the way when it comes to tweezer tip design. Multiple customers use USB Tweezers for exotic applications and we produce standard cold bump pull cavities down to 50µm ball size.

CBP Jaw Cleaner (Contactless cavity cleaner)

During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily. Click here to find out more information about XYZTEC's patented solution: the CBP Jaw Cleaner.

Specifications

Click here to learn about the specifications of XYZTEC's USB Tweezers, which are compatible with the commonly used Condor series: Sigma and 150 High Force.

Watch our video

Click here to watch our automation video.

Subscribe

Your name:

Your email:


Other newsletters

Jul 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
May 2017 Shear testing copper pillar
Mar 2017 Fracture strength of thin wafers and die
Feb 2017 Centralized database for enhanced security and SPC options
Jan 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
Dec 2016 Coating and film testing
Nov 2016 Latest software release enables automatic grading
Oct 2016 Vision enhanced materials testing
Sep 2016 XYZTEC makes lid pull easy
Aug 2016 Condor Sigma W12 with large heater stage
Jul 2016 How to: Wire Pull
Jun 2016 Get 10% off your next tools order
May 2016 Pull testing bumped wafers
Apr 2016 SMD gull wing leads testing
Mar 2016 Automation: matrix bond testing made easy
Feb 2016 Fully integrated solution for automated wafer testing
Jan 2016 In bond testing, size does matter
Dec 2015 XYZTEC goes from strength to strength
Nov 2015 Automatic wire detect
Oct 2015 Highly reproducible stud pull tests are possible
Sep 2015 What is the quality of your coatings?
Aug 2015 Loading samples has never been so easy
Jul 2015 Axis accuracy of ±1µm: essential for automatic bond testing
Jun 2015 Increase your bondtesting throughput
May 2015 USB Tweezers

Subscribe to our RSS-feed to be notified of the latest news automatically. You can also find us on Facebook, LinkedIn, Twitter, Weibo 微博, Google+, YouKu 优酷 and YouTube.



Bond testing seminars

Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.


© 1999-2016 XYZTEC BV Disclaimer, Privacy, Cookies
Home
News
Condor Sigma
Condor 150HF
Test types
Markets & solutions
Sales & support
Downloads
Events
Shop

XYZTEC Netherlands

J.F. Kennedylaan 14-B
5981 XC Panningen
Netherlands (map / route)

Tel: +31-77-3060920
Fax: +31-77-3060919

Find your local representative

XYZTEC Germany

Schäferei 18
06237 Leuna
OT Günthersdorf
Germany
(map / route)
Tel: +49-34638-666690
Fax: +49-34638-666695
Cell: +49-172-3272991

Find other office locations

Technology leader in bond testing worldwide