|31 Jul||Advances in Thin, 3D and MEMS Die Bond Strength Testing|
|19 Jul||XYZTEC granted subsidy for further accuracy improvements|
|23 Jun||Presentation at CSPT 2017 by Bob Sykes|
|06 Jun||Condor Sigma in São Paulo, Brazil|
|31 May||Shear testing copper pillar|
|16 May||Fully automatic lead frame tester introduced at SMT Hybrid Packaging|
|28 Apr||Semicon Penang 2017 successful|
|28 Apr||Pizza and Go cart racing at K1 Speed in Northern CA|
|31 Mar||Fracture strength of thin wafers and die|
|14 Mar||Visit us at Semicon China|
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