The LED (Light Emitting Diode) technology continues to grow requiring new and innovative bond testing solutions. Standard LEDs have evolved over the years to high brightness LEDs.
During daily use, LEDs are exposed to extreme stress levels. Thermo mechanical aging of the dies and bonds are of great concern. Thus, XYZTEC offers wire pull, ball shear, die shear and special tests for wafers and optical components.
In close collaboration with the customer, XYZTEC developed a unique automation integrated solution, based on the standard Condor 100 platform.
Leadframe products often have repetitive patterns, which can be tested automatically with the Condor Sigma. The engineer only needs to program the test sequence once and specify the pitch between the matrix elements. Read more about this time saving feature in our newsletter on matrix bond testing.
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Click here to find out more about bond testing seminars.
Please contact us for more information, to request a demonstration or a quotation.