Cold Bump Pull (CBP) testing with the XYZTEC USB Tweezers provides unparalleled precision and control. The bond of many solder balls is at the bottom of a cavity formed by solder resist layer. In a shear test this supports the bond, resulting in a predominance of solder shear failure modes.
In a pull test the bond is not supported in this fashion, leading to the possibility of more relevant failure modes. Special jaws are required to grip the ball. These reform the upper part of the ball to enable the pull load to be applied without disturbing the bond. Learn more about this in the how-to section of our website.
During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball cavities can be damaged easily. Click here to find out more information about XYZTEC's patented solution: the CBP Jaw Cleaner.
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The Condor Sigma is not only the most accurate bondtester in the world, but also the fastest. Click here to read the study that proves the Condor Sigma is up to 39% faster than the competition.
Please contact us if you have any questions or special bond testing requirements.
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