Productronica 2021
2021-11-16 - 2021-11-19 | Messe München, Am Messeturm, München, 81829, Germany
Visit us at Budatec booth A1.347

World’s Leading Trade Fair for Electronics Development and Production
Being the world’s leading trade fair for electronics development and production, productronica has many new things to offered to its exhibitors and visitors: World premieres and products, solutions and innovations spanning the entire value chain. Exclusive career opportunities with exciting networking formats. And, as usual, a top-class supporting program with specialist trend topics.
At productronica, the decision-makers and thought leaders of the industry come together—from established key player organizations as well as innovative start-ups. As a visitor, you can establish first-class insider contacts and engage in forward-looking networking. With companies from Germany and abroad.

Semicon Taiwan 2021
2021-12-28 - 2021-12-30 | TaiNEX 1, No. 1, Jingmao 2nd Road, Taipei City, Nangang District, Taiwan
Kingyoup M1148
SST K2270

IMAPS Device Packaging Conference 2022
2022-03-07 - 2022-03-10 | WeKoPa Resort and Conference Center, 10438 N Fort McDowell Rd, Scottsdale, AZ 85264, United States
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of DPC 2022. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best event in March and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Conference are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all. Speakers that cannot attend to present in person will have virtual options for delivering their technical presentations at Device Packaging.
Read more: https://www.imaps.org/device_packaging_conference.php

SMT Connect 2022
2022-05-10 - 2022-05-12 | Nürnberg Messe, Messezentrum 1, Nürnberg, 90471, Germany
SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.

Get your free SMT ticket!
Xyztec is exhibiting at the SMTconnect 2022 in Germany from 10-12th May, and we would like to invite you to our booth Hall 4A – Booth 147. Get your free SMT ticket by sending a short e-mail including your full name, telephone number, and company name. You will receive the corresponding code from us to register for the SMTconnect.

ECTC San Diego 2022
2022-05-31 - 2022-06-03 | The Sheraton San Diego Hotel and Marina, 1380 Harbor Island Drive, San Diego, CA, CA 92101, United States
A Premier Event….
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.
The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
The ECTC would not be possible without the sponsorship of the IEEE Electronics Packaging Society (formerly CPMT), numerous corporate participants and sponsors, and the time and energy of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.

PSIC 2022
2022-06-08 - 2022-06-10 | Wuhu Conch International Conference Center
PowerSemiconductorinternational conference 2022 – China 5th International New Energy Auto Power semiconductor technology Forum

EBL 2022
2022-06-14 - 2022-06-15 | Schwabenlandhalle Fellbach, Guntram-Palm-Platz 1, Fellbach, 70734, Germany
11. DVS/GMM-Fachtagung
Daten – Fluch oder Segen?
Begriffe wie „Data-Mining, Cloud Solutions, Atrtificial Intelligence (künstliche Intelligenz)“ etc. sind heute aus dem Zeitalter der Digitalen Transformation nicht mehr weg zu denken. So ist es kein Geheimnis, dass in der modernen Baugruppentechnologie riesige Datenmengen anfallen. Bereits bei der Entwicklung und Konstruktion, der Materialbeschaffung und Lagerung, während der Fertigung, in der Qualitätskontrolle, beim Vertrieb und beim Anwender werden hier mit allen Kräften Daten generiert. Die Digitalisierung hat es möglich gemacht, diese Datenmengen zu erfassen, schnell weiterzuleiten und zu sammeln. Aber was machen wir mit diesen Daten?
Dieser oder ähnlichen Fragen will die 11. DVS/GMM-Fachtagung auf dem Gebiet der elektronischen Baugruppen und Leiterplatten nachgehen und zur Diskussion anregen.
Wir sind auf Ihre Beiträge gespannt und freuen uns darauf, Sie 2022 in Fellbach zu treffen.

Adhesives and Bonding Expo (ABX)
2022-06-28 - 2022-06-30 | Novi Michigan, 46100 Grand River Ave Novi, 48374, United States
Adhesives & Bonding Expo, and the co-located Foam Expo, is a unique opportunity to meet the entire adhesives and bonding supply chain and source high-performing material bonding technologies, including surface treatment, curing, bond inspection and all adhesive formulations. Learn about new market opportunities, the latest bonding processes for binding any material, and automated systems that enable robust and precise material bonding in modern assembly lines.
The conference at Adhesives & Bonding Expo will offer expert insights from high-level technical representatives from across the adhesives and foam markets, equipping you with the knowledge to get ahead of the industry curve and stay ahead of your competitors.

Semicondcutor Association Power Discrete Form
2022-07-20 - 2022-07-22 | Suzhou (China)
The no. 16th China Semicondcutor Association Power Discrete Form

苏州独墅湖世尊酒店
Worldhotel Grand Dushulake Suzhou
江苏省苏州市苏州工业园区启月街299号
No.299 Qiyue Street, Suzhou, 215123, Jiangsu, China

ESREF 2022
2022-09-26 - 2022-09-29 | H4 Hotel Berlin Alexanderplatz, Karl-Liebknecht-Str. 32, Berlin, 10178, Germany
ESREF 2022, the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, will take place in Berlin (Germany) from September 26-29, 2022 at the H4 Hotel Berlin Alexanderplatz.
This international symposium continues to focus on the newest developments and future prospects for quality and reliability management of materials, devices, and circuits for micro-, nano-, and optoelectronics. It provides a European forum for all aspects of reliability management and innovative analytical techniques for present and future electronic applications.

IMAPS Symposium Boston 2022
2022-10-04 - 2022-10-06 | Hynes Convention Center, 900 Boylston St, Boston, MA 02115,, United States
The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!
Read more: https://www.imaps.org/device_packaging_conference.php

CIAS 2022 Innovation Technology Exhibition
2022-10-26 - 2022-10-28 | Hangzhou Kaiyuan Manju Hotel (the Third floor), No. 1359-3, Gudun Road, Liangzhu Street, , Yuhang District, Hangzhou, Zhejiang, China

CSPT China 2022
2022-11-14 - 2022-11-16 | Nantong International Conference Center, No. 99, Xingtong Road, Development Zone,, Nantong, Jiangsu, China
The 20th China Semiconductor Packaging Test Technology and Market Annual Conference

Our agent ExTripod Electronics Technology Limited will show the W12 and standard Sigma here.

MATELEC Spain 2022
2022-11-15 - 2022-11-18 | Feria de Madrid, Spain
International Trade Fair for the Electrical and Electronics Industry

MATELEC is the leading commercial event in southern Europe for the electrical, electronic and telecommunications sector (electrical, telecommunications and network installations, switchgear, mechanisms, cables and conductors, energy storage and self-consumption, electronics, electric vehicles, home automation, building automation and smart cities, etc.
MATELEC takes place under the call of ePower&Building. It includes all the solutions for the life cycle of a building, – Construtec, BIMExpo, Archistone, Veteco and Matelec -, and is expected to bring together 1,600 exhibiting companies.

BioNanoMed
2023-04-12 - 2023-04-14 | Mesago
BioNanoMed 2023 – Nanotechnology enables Personalized Medicine

Be a part of this exclusive know-how-transfer on-site event!
We have the pleasure of inviting you to participate in the 11th International Congress – BioNanoMed 2023 – the exclusive know-how-transfer meeting for researchers, engineers, students and pract

SMTconnect 2023
2023-05-09 - 2023-05-11 | Nürnberg Messe, Messezentrum 1, Nürnberg, 90471, Germany
The trade fair for the electronic production community
SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.

ECTC Orlando
2023-05-30 - 2023-06-02
2023 IEEE 73rd Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.
The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
The ECTC would not be possible without the sponsorship of the IEEE Electronics Packaging Society (formerly CPMT), numerous corporate participants and sponsors, and the time and energy of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.

Semicon China 2023
2023-06-29 - 2023-07-01 | Shanghai New International Expo Centre, 2345 Longyang Rd, Shi Ji Gong Yuan,, Shanghai, Pudong, China
SEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China.

About SEMI
SEMI is a global industry association serving companies that provide equipment materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS), photovoltaic and related technologies. SEMI maintains offices and hosts programs and activities in every major microelectronics and display manufacturing region around the world.
SEMI exists to advance the growth and prosperity of its members and the industries it serves. SEMI does this by creating and delivering access to markets, customers, investors, suppliers, governments, market information and the global industry community. Through its programs and activities, SEMI promotes the development of the microelectronics and display industries, advances the mutual business interests of its members and encourages fair competition and open markets. For more information, please visit www.semi.org.cn

FIEE trade show 2023
2023-07-18 - 2023-07-21 | São Paulo Expo, Brazil
FIEE – International Trade Show of the Electrical, Electronic, Power, Automation and Connectivity Industry, the biggest and most complete event in the sector, now has a new proposal, featuring a segmented show focused on the evolution of the electrical and electronics sectors, presenting Technologies and Solutions for Efficiency and Productivity, Power Generation and Connectivity.
The Show plays host to the most varied economic sectors, such as the telecom, automotive and mobility, energy, services and cities sectors, among others, offering a wide range of solutions and the best business opportunities.
The event is now segmented for its 31st edition, where FIEE Energy is a stage dedicated to all of the infrastructure in the electrical sector, and the energy market and its consumers find solutions for the biggest energy sources.
And FIEE Connectivity, a segment for trends that are transforming industries and making it increasingly convergent, bringing Digital Transformation and Connectivity to the entire ecosystem, with solutions for digital manufacturing, IoT, digitalization, artificial intelligence, blockchain and more.

IMAPS San Diego
2023-10-03 - 2023-10-05
The 56th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held in San Diego, California. This year’s Symposium will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel Level (Advanced RDL); High Performance/High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical…); Advanced Process & Materials (Enabling Tech.)

Productronica 2023
2023-11-14 - 2023-11-17 | Messe München, Am Messeturm, München, 81829, Germany
World’s Leading Trade Fair for Electronics Development and Production
International, innovative, unrivalled: productronica is the only event of its kind to show-case the entire value chain in electronics production—from technologies and components to software and services.
Get your free tickets now!
Please send an e-mail to sales@xyztec.com to receive free tickets for Productronica Munich 2023 and visit us at Hall A2 – Booth 316.

SEMICON Europa 2023
2023-11-14 - 2023-11-17 | Messe München, Am Messeturm, München, 81829, Germany
SEMICON Europa 2023 is co-located with productronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe and broadening the range of attendees across the electronics chain.

Nepcon Japan 2024
2024-01-24 - 2024-01-26 | Tokyo Big Sight, Tokyo Big Sight, Tokyo, Japan
Launched more than 30 years ago, NEPCON JAPAN has grown together with the Japanese & Asian electronics industries. The show specialised in essential areas for electronics manufacturing and R&D, and increased its value as an exhibition representing Asia’s leading one-stop venue for all those involved in the electronics industry.

Semicon Korea
2024-01-31 - 2024-02-02 | Coex Hall A
Beginning with 189 booths in 1987, SEMICON Korea has established itself as an exhibition representing the semiconductor industry thanks to the continuous growth of the Korean semiconductor industry. SEMICON Korea 2024 is scheduled to be held from January 31 to February 2, 2024.
This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With special features including Semiconductor Technology Symposium, Market Trend Forum and Supplier Search Program. This will be a real and strategic opportunity to examine the present and future of the global semiconductor industry.

EBL 2024 Fellbach Germany
2024-03-05 - 2024-03-06 | Schwabenlandhalle Fellbach, Guntram-Palm-Platz 1, Fellbach, 70734, Germany
Elektronische Baugruppen und Leiterplatten (EBL)
12th Electronic Assemblies and PCBs Conference
The DVS, with its research association, organizes industrial research in the field of assembly and connection technology. Together with the GMM, it is the forum for experts from industry and research, with the EBL as the most important German-speaking conference in electronic assembly manufacturing.

IMAPS Scottsdale
2024-03-19 - 2024-03-21 | WeKoPa
Device Packaging
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
DPC 2024 will be co-located with the Workshop on Advanced Packaging for Medical Microelectronics (March 21-22).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Semicon China 2024
2024-03-20 - 2024-03-22 | SNIEC Shanghai
SEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China.

About SEMI
SEMI connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Global Industrie Paris 2024
2024-03-25 - 2024-03-28 | Paris Nord Villepinte, France
The meeting place for the whole industrial ecosystem.
As a cornerstone in reindustrialization, Global Industrie symbolizes the commitment and pride of industrial players. A Showcase for Regions, know-how and the essential presence of industry in our everyday lives, it is above all a place to meet and do business for those who are shaping today’s and tomorrow’s industry, and an opportunity to show their fighting spirit.

CIAS 2024
2024-04-22 - 2024-04-24 | Suzhou (China)

ECTC Denver 2024
2024-05-28 - 2024-07-30 | Gaylord Rockies Resort, United States
